MICHAEL P MARTINEZ
Engineering in Worcester, MA
License number
Massachusetts 19535
Issued Date
Oct 27, 2001
Type
Engineer in Training
Address
Address
Worcester, MA 01609
Professional information
High Performance Power Device
US Patent:
7742307, Jun 22, 2010
Filed:
Jan 17, 2008
Appl. No.:
12/015918
Inventors:
Joseph R. Ellsworth - Worcester MA, US
Michael P. Martinez - Worcester MA, US
Stephen J. Pereira - Hopedale MA, US
Michael P. Martinez - Worcester MA, US
Stephen J. Pereira - Hopedale MA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 7/20, B32B 3/26
US Classification:
361720, 361699, 361704, 361707, 361719, 4283202, 4283227
Abstract:
A printed circuit board (PCB) assembly is provided. The PCB assembly is adapted for mounting at least one heat-generating electrical device and providing integrated heat dissipating capability to dissipate heat generated by the electrical device. The PCB assembly has a top surface and a bottom surface and comprises a signal carrying layer and an insert of pyrolytic graphite (PG). The signal carrying layer, disposed between the top surface and the bottom surface, comprises a material that is both thermally conductive and electrically conductive (such as at least one of aluminum, copper, and silver and alloys thereof) and has at least a portion lying in a first plane. The insert of PG is disposed within at least a portion of the first plane of the signal carrying layer, is in thermal contact with the signal carrying layer, and is constructed and arranged to have its greatest electrical conductivity in the first plane. Optionally, a conductive via can be formed in portions of the signal carrying layer not occupied by the insert of PG, where the conductive via operably couples a first side of the signal carrying layer to a second side of the signal carrying layer.
Heat Sink Interface Having Three-Dimensional Tolerance Compensation
US Patent:
8537552, Sep 17, 2013
Filed:
Sep 25, 2009
Appl. No.:
12/566818
Inventors:
Jeffrey Paquette - Newton MA, US
Scott R. Cheyne - Brookline MA, US
Joseph R. Ellsworth - Pelham NH, US
Michael P. Martinez - Worcester MA, US
Michael R. Trahan - Northbridge MA, US
Scott R. Cheyne - Brookline MA, US
Joseph R. Ellsworth - Pelham NH, US
Michael P. Martinez - Worcester MA, US
Michael R. Trahan - Northbridge MA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 7/20, F28F 7/00, H01Q 11/00
US Classification:
361710, 361717, 361711, 165185
Abstract:
A thermal interface includes a plurality of elevated regions and a plurality of mechanical tolerance circuits coupled to the plurality of elevated regions. The thermal interface is configured to be disposed between an array of heat generating elements and a heat sink with each of the plurality of elevated regions thermally coupled to a corresponding one or more of the array of heat generating elements. In one embodiment, the thermal interface provides a thermal path between a printed wiring board having a plurality of flip-chip circuit components disposed on an external surface thereof and a heat sink disposed over the flip-chip circuit components.
High Performance Compact Heat Exchanger
US Patent:
2010003, Feb 18, 2010
Filed:
Aug 15, 2008
Appl. No.:
12/228808
Inventors:
Joseph R. Ellsworth - Worcester MA, US
Scott R. Cheyne - Brookline NH, US
Michael E. Null - Marlborough MA, US
Michael P. Martinez - Worcester MA, US
David H. Altman - Framingham MA, US
Anthony J. Burdi - Waltham MA, US
Scott R. Cheyne - Brookline NH, US
Michael E. Null - Marlborough MA, US
Michael P. Martinez - Worcester MA, US
David H. Altman - Framingham MA, US
Anthony J. Burdi - Waltham MA, US
International Classification:
F28F 7/00, F24H 3/02
US Classification:
165 803, 165121
Abstract:
A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser.
Pneumatic Presssure Wedge
US Patent:
2010003, Feb 18, 2010
Filed:
Aug 15, 2008
Appl. No.:
12/228699
Inventors:
Paul A. Danello - Franklin MA, US
Michael P. Martinez - Worcester MA, US
Russell D. Belanger - Tyngsborough MA, US
Joaquim A. Bento - Marlborough MA, US
Joseph R. Ellsworth - Worcester MA, US
Michael P. Martinez - Worcester MA, US
Russell D. Belanger - Tyngsborough MA, US
Joaquim A. Bento - Marlborough MA, US
Joseph R. Ellsworth - Worcester MA, US
International Classification:
H05K 7/20
US Classification:
361691
Abstract:
An electronic subsystem such as an array of radar transmit/receive microwave modules are associated with (e.g., base mounted to) spaced heat sinks. There is an electronic module on each side of each heat sink and an inflatable bladder or “pneumatic pressure wedge” between adjacent heat sinks biases a pair of electronic modules against their respective heat sinks.