MICHAEL MING-YIN CHAN, M.D.
Radiology at 32 Ave, Portland, OR
License number
Oregon 21125
Category
Radiology
Type
Diagnostic Radiology
Address
Address
2
10150 SE 32Nd Ave, Portland, OR 97222
PO Box 547, Corvallis, OR 97339
PO Box 547, Corvallis, OR 97339
Phone
(503) 513-8300
(541) 758-5047
(541) 758-3713 (Fax)
(541) 758-5047
(541) 758-3713 (Fax)
Personal information
See more information about MICHAEL MING-YIN CHAN at radaris.comName
Address
Phone
4325 SE 27Th Ave, Portland, OR 97202
16072 Flavel Dr, Portland, OR 97236
8631 Crystal Springs Blvd, Portland, OR 97266
9323 91St Ave, Portland, OR 97266
6600 Austin Dr, Hillsboro, OR 97123
Professional information
See more information about MICHAEL MING-YIN CHAN at trustoria.com
Is/It Director At Portland Spirit
Is/It Director At Portland Spirit
Position:
IS/IT Director at Portland Spirit, IS/IT Director at American Waterways, Inc
Location:
Portland, Oregon Area
Industry:
Hospitality
Work:
Portland Spirit
since 1997
-
IS/IT Director
American Waterways, Inc
since 1997
-
IS/IT Director
WMAX Radio 106.7
1994 - 1996
-
Announcer, Producer
WCMF, WRMM Radio
1989 - 1994
-
Announcer, Producer
Education:
Rochester Institute of Technology 1986 - 1990
Michael Ming-Yin Chan, Portland OR
Michael Ming-Yin Chan, Portland OR
Specialties:
Radiology, Diagnostic Radiology
Work:
Providence Milwaukie Hospital
10150 SE 32Nd Ave, Portland, OR 97222 Radiology Specialists of The Northwest
545 NE 47Th Ave, Portland, OR 97213
10150 SE 32Nd Ave, Portland, OR 97222 Radiology Specialists of The Northwest
545 NE 47Th Ave, Portland, OR 97213
Education:
University of Washington (1992)
Dr. Michael M Chan, Milwaukie OR - MD (Doctor of Medicine)
Dr. Michael M Chan, Milwaukie OR - MD (Doctor of Medicine)
Specialties:
Diagnostic Radiology
Address:
Radiology Specialist Northwest
10150 SE 32Nd Ave, Milwaukie 97222
(503) 513-8350 (Phone)
Portland Medical Imaging
10538 SE Washington St, Portland 97216
(503) 215-8900 (Phone)
10150 SE 32Nd Ave, Milwaukie 97222
(503) 513-8350 (Phone)
Portland Medical Imaging
10538 SE Washington St, Portland 97216
(503) 215-8900 (Phone)
Certifications:
Diagnostic Radiology, 1997
Awards:
Healthgrades Honor Roll
Languages:
English, Chinese, Cantonese
Hospitals:
Radiology Specialist Northwest
10150 SE 32Nd Ave, Milwaukie 97222
Portland Medical Imaging
10538 SE Washington St, Portland 97216
Providence Milwaukie Hospital
10150 East 32Nd Ave, Milwaukie 97222
Providence Portland Medical Center
4805 East Glisan St, Portland 97213
10150 SE 32Nd Ave, Milwaukie 97222
Portland Medical Imaging
10538 SE Washington St, Portland 97216
Providence Milwaukie Hospital
10150 East 32Nd Ave, Milwaukie 97222
Providence Portland Medical Center
4805 East Glisan St, Portland 97213
Education:
Medical School
University Of Washington School Of Medicine
Graduated: 1992
Kaiser Fdn Hospital
Graduated: 1997
Uc
Graduated: 1998
University Of Washington School Of Medicine
Graduated: 1992
Kaiser Fdn Hospital
Graduated: 1997
Uc
Graduated: 1998
Michael Ming-Yin Chan, Portland OR
Michael Ming-Yin Chan, Portland OR
Specialties:
Radiologist
Address:
10150 Se 32Nd Ave, Portland, OR 97222
Education:
University of Washington, School of Medicine - Doctor of Medicine
Kaiser Permanente Los Angeles Medical Center - Residency - Diagnostic Radiology
Kaiser Permanente Los Angeles Medical Center - Residency - Diagnostic Radiology
Board certifications:
American Board of Radiology Certification in Diagnostic Radiology (Radiology)
Independent Political Organization Professional
Independent Political Organization Professional
Location:
Portland, Oregon Area
Industry:
Political Organization
Bonded Wafer Processing Method
Bonded Wafer Processing Method
US Patent:
7129172, Oct 31, 2006
Filed:
Mar 29, 2004
Appl. No.:
10/811758
Inventors:
Patrick Morrow - Portland OR, US
R. Scott List - Beaverton OR, US
Michael Y. Chan - Portland OR, US
R. Scott List - Beaverton OR, US
Michael Y. Chan - Portland OR, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 21/302
US Classification:
438690, 438455, 438459, 438706, 438745, 438977
Abstract:
According to one embodiment a method is disclosed. The method includes applying a photoresist layer to a first wafer, etching the first wafer, bonding the first wafer to a second wafer and thinning the first wafer; wherein an unsupported bevel portion of the first wafer is removed.