MICHAEL JAMES MOORE
Pilots at Star Thistle Dr, Fort Worth, TX

8173906, May 8, 2012

Aug 31, 2007

11/848891

John M. Bedinger - Garland TX, US
Michael A. Moore - Fort Worth TX, US

Raytheon Company - Waltham MA

H05K 1/00

174258, 361760

According to one embodiment of the disclosure, an environmental protection coating comprises a circuit assembly having a first protective dielectric layer and a second dielectric layer. The circuit assembly has an outer surface on which a plurality of discrete electrical components are attached. The first protective dielectric layer overlays the circuit assembly. The second dielectric layer overlays the first protective dielectric layer and is made of a dielectric material having modulus of elasticity less than 3. 5 Giga-Pascal (GPa), dielectric constant less than 2. 7, dielectric loss less than 0. 008, breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), temperature stability to 300° Celsius, defect densities less than 0. 5/centimeter, pinhole free in films greater than 50 Angstroms, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.

8552813, Oct 8, 2013

Nov 23, 2011

13/303823

Darin M. Gritters - Yucaipa CA, US
Kenneth W. Brown - Yucaipa CA, US
Andrew K. Brown - Hesperia CA, US
Michael A. Moore - Fort Worth TX, US
Patrick J. Kocurek - Allen TX, US
Thomas A. Hanft - Allen TX, US

Raytheon Company - Waltham MA

H03H 5/00

333 26, 333 34

Embodiments of the invention are directed toward a novel printed antenna that provides a low-loss transition into waveguide. The antenna is integrated with a heat spreader and the interconnection between the antenna and the output device (such as a power amplifier) is a simple conductive connection, such as (but not limited to), a wirebond. Integrating the antenna with the heat spreader in accordance with the concepts, circuits, and techniques described herein drastically shortens the distance from the output device to the waveguide, thus reducing losses and increasing bandwidth. The transition and technique described herein may be easily scaled for both higher and lower frequencies. Embodiments of the present apparatus also eliminate the complexity of the prior art circuit boards and transitions and enable the use of a wider range of substrates while greatly simplifying assembly.

8148830, Apr 3, 2012

Jul 31, 2009

12/533409

John M. Bedinger - Garland TX, US
Michael A. Moore - Fort Worth TX, US

Raytheon Company - Waltham MA

H01L 23/29

257790

A circuit board assembly includes a circuit board having an outer surface configured with a plurality of discrete electrical components. The assembly includes a first protective dielectric layer overlying the outer surface, and a second dielectric layer overlying the first protective dielectric layer and the discrete electrical components. The second dielectric layer includes a dielectric material having modulus of elasticity less than 3. 5 Giga-Pascal (GPa), a dielectric constant less than 3. 0, a dielectric loss less than 0. 008, a moisture absorption less than 0. 04 percent, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 300° Celsius, pinhole free in films greater than 50 Angstroms, hydrophobic with a wetting angle greater than 45 degrees, capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 30%.

2009029, Nov 26, 2009

Jul 31, 2009

12/533503

John M. Bedinger - Garland TX, US
Michael A. Moore - Fort Worth TX, US

Raytheon Company - Waltham MA

B05D 5/12

427 962

A method includes providing a circuit board having an outer surface, the outer surface configured with a plurality of discrete electrical components that are each manufactured independently of one another, and coating the outer surface and the plurality of discrete electrical components with a first protective dielectric layer. The method further includes coating the first protective dielectric layer with a second dielectric layer. The second dielectric layer includes a dielectric material having a modulus of elasticity less than 3.5 Giga-Pascal (GPa), a dielectric constant less than 2.7, a dielectric loss less than 0.002, a breakdown voltage strength in excess of 2 million volts/centimeter (MV/cm), a temperature stability to 3000 Celsius, a defect densities less than 0.5/centimeter, a pinhole free in films greater than 50 Angstroms, and is capable of being deposited conformally over and under 3D structures with thickness uniformity less than or equal to 10%.