MICHAEL J TULLY, MD
Anesthesiologist Assistant at Oakdale Ave, Minneapolis, MN

License number
Minnesota 43460
Category
Osteopathic Medicine
Type
Anesthesiology
Address
Address
3300 Oakdale Ave N, Minneapolis, MN 55422
Phone
(763) 520-5370
(763) 559-3779
(763) 450-3986 (Fax)

Personal information

See more information about MICHAEL J TULLY at radaris.com
Name
Address
Phone
Michael Tully
4024 Drew Ave S, Minneapolis, MN 55410
Michael M Tully
602 7Th Ave NE, Kasson, MN 55944
(507) 634-4114

Professional information

Michael J Tully Photo 1

Dr. Michael J Tully, Maple Grove MN - MD (Doctor of Medicine)

Specialties:
Anesthesiology
Address:
Anesthesiology, PA
9855 Hospital Dr, Maple Grove 55369
(763) 981-3200 (Phone)
WestHealth, Inc
2855 Campus Dr, Plymouth 55441
(763) 577-7000 (Phone)
Anesthesiology, PA
3300 Oakdale Ave, Robbinsdale 55422
(763) 520-5370 (Phone)
Anesthesiology, PA
9875 Hospital Dr, Maple Grove 55369
(763) 581-1000 (Phone)
Certifications:
Anesthesiology, 2004
Awards:
Healthgrades Honor Roll
Languages:
English
Hospitals:
Anesthesiology, PA
9855 Hospital Dr, Maple Grove 55369
Anesthesiology, PA
9875 Hospital Dr, Maple Grove 55369
Anesthesiology, PA
3300 Oakdale Ave, Robbinsdale 55422
WestHealth, Inc
2855 Campus Dr, Plymouth 55441
North Memorial Medical Center
3300 Oakdale Ave North, Robbinsdale 55422
Education:
Medical School
University Of Minnesota Medical School
Graduated: 1999
Mayo Grad School Med/Mayo Fndn


Michael Tully Photo 2

Surface Mount Adapter Apparatus And Methods Regarding Same

US Patent:
7368814, May 6, 2008
Filed:
Mar 24, 2005
Appl. No.:
11/088573
Inventors:
Michael J. Tully - Minneapolis MN, US
Ranjit R. Patil - Eagan MN, US
Assignee:
Ironwood Electronics, Inc. - Eagan MN
International Classification:
H01L 23/12
US Classification:
257700, 439 66, 361760
Abstract:
An adapter apparatus and methods for using in providing such adapter apparatus include providing a high density interconnect board (e. g. , having a pattern of contact pads on a first side thereof corresponding to a packaged device, such as a micro lead frame package) and providing an interconnect device. Interconnect elements extend through a substrate of the interconnect device and are electrically connected to conductive pads on a second side of the high density interconnect board.