MICHAEL CHU-MING LEE
Medical Practice in San Jose, CA

2005019, Sep 1, 2005

Oct 23, 2003

10/691948

Michael Lee - San Jose CA, US

G03G015/16

399313000

This disclosure relates to a modified transfer-roll system and method for electrophotographic printing or the like. A photoconductor, e.g., a photoconductive roller or belt, is provided for collecting a first photostatic charge in a selected form corresponding to an image to be printed, and for retaining toner in the form of the image on a first surface of printing media. Using a first selected voltage from a first power source, a photostatic charging device, such as a charge roller and/or corona, is used to apply the first photostatic charge to the photoconductor. A laser write device activates selected portions of the charge applied to the photoconductor, such portions being in the form of the image. A development roller then transfers toner to the photoconductor, the toner photostatically adhering to the photoconductor in the form of the image. A transfer roller, in contact with the photoconductor at a selected transfer point, transfers the toner image from the photoconductor to the first surface of the printing media. At least one end of the transfer roller is sized and configured for accommodating overhanging edges of printing media as a setback from the paper edges and for clearance from toner on the photoconductor. A second power source applies a second selected voltage to the transfer roller, thereby attracting toner thereto, so as to effect transfer of the toner image from the photoconductor to the printing media first surface. Alternatively, a second surface of the printing media has a second photostatic charge to attract the toner retained by the photoconductor for transfer of the toner image.

2009017, Jul 9, 2009

Jan 3, 2008

12/006617

Michael M. Lee - San Jose CA, US

Apple Inc. - Cupertino CA

H04M 1/64

379 8811

Systems and methods for enabling users to listen to outgoing voice mail messages are provided. These systems and methods record an audio file corresponding to a voice message being left by a user during an outgoing telephone call to a recipient, link the audio file to contact information associated with the recipient, and provide the user access to the audio file through, for example, playback of the audio included in the file. These systems and methods may be implemented through individual communications devices, such as an iPhone, through a telephone communications provider, or a combination of the same.

2009017, Jul 9, 2009

Apr 2, 2008

12/080523

Michael M. Lee - San Jose CA, US

G06F 17/20, G06F 17/00

700 94

Methods, systems and computer readable media for altering an audio output are provided. In some embodiments, the system may change the original frequency content of an audio data file to a second frequency content so that a recorded audio track will sound as if a different person had recorded it when it is played back. In other embodiments, the system may receive an audio data file and a voice signature, and it may apply the voice signature to the audio data file to alter the audio output of the audio data file. In that instance, the audio data file may be a textual representation of a recorded audio data file.

2002011, Aug 29, 2002

Feb 23, 2001

09/792479

Michael Lee - San Jose CA, US
Wen-chou Wang - Cupertino CA, US

H01L023/48, H01L023/52, H01L029/40

257/758000

A method for forming a multilayer circuit substrate is disclosed. Preferably, a multilayer circuit substrate precursor is formed using a build up process. The multilayer circuit substrate precursor comprises an internal conductive post, an internal conductive layer coupled to one end of the conductive post, and an dielectric layer disposed around the conductive post. The multilayer circuit substrate precursor and the conductive post are cut to form a side electrical contact structure from the cut post.

4733268, Mar 22, 1988

May 9, 1986

6/861487

Gary S. Beardsley - Morgan Hill CA
Michael H. Lee - San Jose CA

International Business Machines Corporation - New York NY

G03G 1508

355 3DD

An electrophotographic apparatus is provided with an electrically conductive voltage control bar between the photoconductor drum or belt and the developer or developer/cleaner roll. The voltage control bar prevents toner filming on said cleaning roll, and makes it possible for that roll to be made of an insulating material such as molded plastic.

D314950, Feb 26, 1991

Jan 8, 1990

7/461779

Tuan T. Vu - San Jose CA
Michael J. Lee - San Jose CA
Siamak Salimpour - Danville CA
Philip G. Yurkonis - Campbell CA
Herbert Pfeifer - San Jose CA
Nick Brawne - San Francisco CA
Howell Hsiao - Mountain View CA

Sun Microsystems - Mountain View CA

D14102

5891354, Apr 6, 1999

Jul 26, 1996

8/687723

Michael G. Lee - San Jose CA
Solomon I. Beilin - San Carlos CA
William T. Chou - Cupertino CA
Michael G. Peters - San Clara CA
Wen-chou Vincent Wang - Cupertino CA

Fujitsu Limited - Hong Kong

B44C 122, H05K 306

216 99

Methods of wet etching through a silicon substrate using composite etch-stop layers are disclosed. In one embodiment, the composite etch stop comprises a layer of silicon dioxide and a layer of polyimide.

5406446, Apr 11, 1995

Feb 25, 1994

8/201628

Michael G. Peters - Santa Clara CA
William T. Chou - Cupertino CA
Wen-chou V. Wang - Cupertino CA
Michael G. Lee - San Jose CA
Solomon I. Beilin - San Carlos CA

Fujitsu Limited - Kanagawa

H01G 114

3613061

A thin-film bypass capacitor is fabricated by forming a plurality of through holes through the thickness of a nonconductive base substrate and filling the through holes with a conductive material to form ground vias and power vias. A sequence of back side metalization layers are applied to the back side surface of the base substrate. A sequence of bottom contact layers are applied to the front side surface of the base substrate. A bottom contact power terminal is formed and a bottom contact metalization layer is applied to the surface of the bottom contact layers. A portion of the metalization layer is removed and an insulating layer is formed on the surface of the bottom contact metalization layer. A ground metalization feedthrough and a power metalization feedthrough are formed at the surface of the insulating layer. A sequence of top contact layers are applied to the surface of the insulating layer and a front side ground terminal and front side power terminal are formed.