MICHAEL ALAN JASSOWSKI
Pilots at China Hl Rd, Nashville, CA
License number
California C1066967
Category
Airmen
Address
Address
4808 China Hill Rd, Nashville, CA 95623
Professional information
Semiconductor Device Inlcluding Optimized Driver Layout For Integrated Circuit With Staggered Bond Pads
US Patent:
6784558, Aug 31, 2004
Filed:
Jul 11, 2003
Appl. No.:
10/618381
Inventors:
Michael A. Jassowski - El Dorado CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2940
US Classification:
257786, 257202, 257203, 257207
Abstract:
An embodiment of an integrated circuit die with staggered bond pads and optimized driver layout includes a staggered array of bond pads with an outer ring of bond pads and an inner ring of bond pads. Driver/ESD circuit cells for the outer ring of bond pads are located to the outside of the bond pads (between the outer ring of bond pads and the nearest die edge). The driver/ESD cells for the inner ring of bond pads are located to the inside of the bond pads (between the inner ring of bond pads and the die core). The integrated circuit die is coupled to a lead frame via bond wires.
Optimized Driver Layout For Integrated Circuits With Staggered Bond Pads
US Patent:
2005026, Dec 8, 2005
Filed:
Aug 9, 2005
Appl. No.:
11/200903
Inventors:
Michael Jassowski - El Dorado CA, US
International Classification:
H01L023/48
US Classification:
257786000, 257784000
Abstract:
One embodiment of a method and system is disclosed. The method configures a plurality of bond pads on a die arranged in a staggered array. The staggered array includes an inner and outer ring of bond pads. A first plurality of driver cells are placed to the outside of the plurality bond pads, and then a second plurality of driver cells are placed to the inside of the plurality of bond pads.