MICHAEL ALAN ANKROM, M.D.
Osteopathic Medicine at Charles St, Baltimore, MD

4909429, Mar 20, 1990

Oct 14, 1988

7/257911

Michael J. Ankrom - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B23K 100

228 57

A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.

4801069, Jan 31, 1989

Mar 30, 1987

7/032427

Michael J. Ankrom - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B23K 3102

2281802

A method and an apparatus for depositing solder onto component lead pads of a printed wiring board. Solder preforms which are multi-layer, solder containing members are positively biased against the pwb pad which is then introduced into a vapor phase environment defining a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The pwb is heated according to a controlled process in which the temperature of the pwb is continuously monitored. The apparatus is a pressure fixture usable for vapor phase solder deposition of a pwb and comprises a first and a second member which are removably fastened together in an opposed relationship with a pwb is disposed between the first and the second members.

5024734, Jun 18, 1991

Dec 27, 1989

7/457421

Walter M. Downs - Lutherville MD
Michael J. Ankrom - Baltimore MD

Westinghouse Electric Corp. - Pittsburgh PA

C25D 502, C25D 548, C25D 510, B05D 512

204 15

A circuit trace/solder pad interface for closely spaced circuit traces is presented in which solder must be deposited to form a solder pad upon the circuit trace and the solder not migrate onto the circuit trace upon solder reflow. Through the intentional selection of solderably incompatible metals for the circuit trace and the solder pad, the solder pad may be isolated from the circuit trace thereby retaining solder on the pad. Furthermore a method for fabricating this circuit trace/solder pad interface is presented.

4840305, Jun 20, 1989

Mar 30, 1987

7/032426

Michael J. Ankrom - Baltimore MD
Corey H. Bowcutt - Annapolis MD
John J. Buckley - Baltimore MD
James A. Rew - Millersville MD

Westinghouse Electric Corp. - Pittsburgh PA

B23K 3102

228232

A method for vapor phase soldering components onto a PWB onto which solder has been previously deposited includes the steps of applying a fluxing agent on the PWB and introducing the PWB into a vapor phase environment. The application of flux is a multi-step process which includes a sequential application of flux to the PWB. The vapor phase environment defines a temperature gradient between approximately ambient and the temperature of a saturated vapor of a first selected fluid which defines a primary saturated vapor phase with a boiling point which is greater than the melting point of solder. A second fluid having a boiling point which is lower than the first fluid is utilized to generate a secondary vapor blanket in order to prevent excessive loss of the fluid defining the primary vapor phase. The PWB is heated according to a controlled process in which the temperature of the PWB is continuously monitored.

5831409, Nov 3, 1998

Feb 28, 1997

8/808354

Frank A. Lindberg - Baltimore MD
David L. Schantz - Ellicott City MD
Brian H. Smith - Arnold MD
Charles S. Kerfoot - Pasadena MD
Joseph J. Springer - Bel Air MD
Patricia A. O'Donnell - Davidsonville MD
James H. DeOms - Glen Arm MD
Ronnie L. Starling - Columbia MD
Michael J. Ankrom - Baltimore MD
James L. Munro - Severna Park MD
Geoffrey B. Lansberry - Bowie MD
Beth A. Herman - Columbia MD
William B. Hall - Annapolis MD
Marshall G. Jones - Joppa MD
William B. Winkel - Bowie MD
Brian A. DeAbreu - Bowie MD
Thomas C. Underwood - Laurel MD
Todd M. Zaranski - Baltimore MD
Aaron D. Valdivia - Woodstock MD
Richard M. Young - Millersville MD
Frank E. Altoz - Baltimore MD
Ngon B. Nguyen - Jessup MD
Eric L. Mohler - Annapolis MD

Northrop Grumman Corporation - Los Angeles CA

H02H 07122

318801

An electric vehicle propulsion system having a motor with first and second electrically isolated windings and a system control unit for controlling the motor, wherein the system control unit includes a first power bridge for driving the first windings and a second power bridge for driving the second windings.

5567991, Oct 22, 1996

Jun 10, 1994

8/258117

David L. Schantz - Ellicott City MD
James H. DeOms - Glen Arm MD
Ronnie L. Starling - Columbia MD
Michael J. Ankrom - Baltimore MD

Northrop Grumman Corporation - Los Angeles CA

H01R 909

307 101

An electric vehicle relay assembly including a main relay and a flexible circuit electrically connected to the main relay. The relay assembly further includes a connection for mounting the flexible circuit onto the main relay and a wiring board affixed to the flexible circuit. The flexible circuit compensates for mechanical tolerance errors within the connection. The wiring board includes relay circuitry electrically connected to the flexible circuit.