MICHAEL A ZIMMERMAN
Engineering in North Andover, MA
License number
Massachusetts 33070
Issued Date
Feb 20, 1987
Expiration Date
Jun 30, 2018
Type
Mechanical Engineer
Address
Address
North Andover, MA 01845
Personal information
See more information about MICHAEL A ZIMMERMAN at radaris.comName
Address
Phone
55 Rosemont Dr, North Andover, MA 01845
27 Sunnydale Cir, Brimfield, MA 01010
39 Ellis St, Medway, MA 02053
163 Brimfield Rd, Monson, MA 01057
39 Ellis St, Medway, MA 02053
Professional information
Dual Network Housing Device
US Patent:
6510226, Jan 21, 2003
Filed:
Jan 21, 2000
Appl. No.:
09/489321
Inventors:
Brian J. Thomann - Tewksbury MA
Michael A. Zimmerman - North Andover MA
Michael A. Zimmerman - North Andover MA
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H04M 100
US Classification:
37941304
Abstract:
An improved network housing device for protecting telecommunications and electrical systems disposed in the outdoors from foreign objects and influences of the weather and atmosphere comprises a dual enclosure device having an outer enclosure and an inner enclosure unit. With this dual structure, requirements imposed by outdoor use can be allocated among the outer and inner units, with the outer unit fulfilling weatherability and ultra-violet stability requirements, and the inner unit fulfilling low-flammability requirements. The device may be fabricated entirely with plastic to provide a reliable and low-cost housing.
Patch Antenna Using Non-Conductive Frame
US Patent:
6421011, Jul 16, 2002
Filed:
Oct 22, 1999
Appl. No.:
09/425374
Inventors:
Maarten Van Egmond - Rijnsburg, NL
Keith V. Guinn - Basking Ridge NJ
Stelios Papatheodorou - Morristown NJ
Edward Bryan Roberts - Bath, GB
Ming-Ju Tsai - Livingston NJ
Michael A. Zimmerman - North Andover MA
Keith V. Guinn - Basking Ridge NJ
Stelios Papatheodorou - Morristown NJ
Edward Bryan Roberts - Bath, GB
Ming-Ju Tsai - Livingston NJ
Michael A. Zimmerman - North Andover MA
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H01Q 138
US Classification:
343700MS, 343872
Abstract:
A non-conductive frame supports the resonators in a patch antenna assembly. The frame supports the resonators without making holes in the resonators and thereby avoids the problem of creating unwanted electric field polarizations. Additionally, the frame grasps the resonators in areas of low current density and thereby avoids creating additional disturbances in the radiation pattern. The frames may also include posts that are used to attach the frames to the feedboard without using additional components such as screws.
Plastic Electronic Component Package
US Patent:
2008015, Jun 26, 2008
Filed:
Dec 12, 2007
Appl. No.:
12/001792
Inventors:
Michael A. Zimmerman - North Andover MA, US
Keith Smith - Methuen MA, US
Jacob Shverdin - Swampscott MA, US
Keith Smith - Methuen MA, US
Jacob Shverdin - Swampscott MA, US
International Classification:
H01L 31/0203, H01L 23/495, H01L 21/60
US Classification:
257433, 438123, 257676, 277590, 428633, 257E23031, 257E21506, 257E3111
Abstract:
A plastic package for an image sensor or other electronic component which comprises a plastic body, preferably of LCP material, molded around a leadframe and defining a cavity in which the image sensor is to be disposed. A lid assembly is provided having a transparent glass lid retained in a plastic lid frame which is weldable or otherwise bondable to the plastic body of the package to enclose the image sensor mounted in the cavity. The leadframe is usually composed of copper or a copper alloy, or a ferrous alloy having a copper coating. An interfacial layer is formed on the surfaces of the leadframe at least in those portions which are in contact with the plastic body which serves to provide substantially improved adhesion between the leadframe and the plastic material to achieve a hermetic bond between the metal and plastic materials. The interfacial layer is composed of a cuprous oxide base layer formed on a surface of the leadframe, and a cupric oxide layer formed on the cuprous oxide layer. The cupric oxide outer layer has an acicular structure which provides an interlocking mechanism for adhesion to the plastic material molded thereto in forming the package.
Ultra High-Temperature Plastic Package And Method Of Manufacture
US Patent:
7803307, Sep 28, 2010
Filed:
Jun 7, 2005
Appl. No.:
11/146856
Inventors:
Michael Zimmerman - North Andover MA, US
Assignee:
Interplex QLP, Inc. - College Point NY
International Classification:
C08J 5/02, C08G 63/06
US Classification:
26433111, 528271
Abstract:
A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame.
Lead For Integrated Circuit Package
US Patent:
2005001, Jan 20, 2005
Filed:
Aug 18, 2004
Appl. No.:
10/920957
Inventors:
Michael Zimmerman - North Andover MA, US
International Classification:
H01L023/495
US Classification:
257666000
Abstract:
A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features.
Flange For Integrated Circuit Package
US Patent:
7053299, May 30, 2006
Filed:
Aug 18, 2004
Appl. No.:
10/920660
Inventors:
Michael Zimmerman - North Andover MA, US
Assignee:
Quantum Leap Packaging, Inc. - Wilmington MA
International Classification:
H01L 23/02
US Classification:
174 524, 174 525, 257698
Abstract:
A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature.
Leadframe With Different Topologies For Mems Package
US Patent:
2008015, Jun 26, 2008
Filed:
Oct 19, 2007
Appl. No.:
11/875130
Inventors:
Michael A. Zimmerman - North Andover MA, US
Keith Smith - Methuen MA, US
Kieran P. Harney - Andover MA, US
John R. Martin - Foxborough MA, US
Lawrence E. Felton - Hopkinton MA, US
Keith Smith - Methuen MA, US
Kieran P. Harney - Andover MA, US
John R. Martin - Foxborough MA, US
Lawrence E. Felton - Hopkinton MA, US
International Classification:
H01L 23/495, H01L 21/02
US Classification:
257676, 438123, 257E21002, 257E23043
Abstract:
A package for a micro-electromechanical (MEMS) device is described. A premolded leadframe base has opposing top and bottom surfaces. Each surface is defined by a topology having at least one electrically conductive portion and at least one electrically non-conductive portion, and the topology of the top surface differs from the topology of the bottom surface.
Methods For Enclosing A Thermoplastic Package
US Patent:
2005001, Jan 27, 2005
Filed:
Aug 18, 2004
Appl. No.:
10/920643
Inventors:
Michael Zimmerman - North Andover MA, US
International Classification:
H05K005/06
US Classification:
174052300
Abstract:
A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. A lid is welded to the frame after a die is attached to the flange.
Thermoplastic Material
US Patent:
7736573, Jun 15, 2010
Filed:
Aug 18, 2004
Appl. No.:
10/920857
Inventors:
Michael Zimmerman - North Andover MA, US
Assignee:
Interplex QLP, Inc. - College Point NY
International Classification:
B29C 45/00
US Classification:
2643281, 26432818
Abstract:
A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.
Thermoplastic Material
US Patent:
2010020, Aug 12, 2010
Filed:
Apr 14, 2010
Appl. No.:
12/759844
Inventors:
Michael Zimmerman - North Andover MA, US
International Classification:
B32B 5/12
US Classification:
428114
Abstract:
A circuit package for housing semiconductor or other integrated circuit devices (“die”) includes a high-copper flange, one or more high-copper leads and a liquid crystal polymer frame molded to the flange and the leads. The flange includes a dovetail-shaped groove or other frame retention feature that mechanically interlocks with the molded frame. During molding, a portion of the frame forms a key that freezes in or around the frame retention feature. The leads include one or more lead retention features to mechanically interlock with the frame. During molding, a portion of the frame freezes in or adjacent these lead retention features. The frame includes compounds to prevent moisture infiltration and match its coefficient of thermal expansion (CTE) to the CTE of the leads and flange. The is frame is formulated to withstand die-attach temperatures. A lid is ultrasonically welded to the frame after a die is attached to the flange.