MATTHIAS F COMERFORD
Engineering in Newton, MA
License number
Massachusetts 17414
Expiration Date
Jun 30, 1984
Type
Metallurgical Engineer
Address
Address
Newton, MA 02461
Personal information
See more information about MATTHIAS F COMERFORD at radaris.comName
Address
Phone
39 Chester St, Newton Highlands, MA 02461
Professional information
Mass Wave Soldering System
US Patent:
4566624, Jan 28, 1986
Filed:
Dec 16, 1983
Appl. No.:
6/562407
Inventors:
Matthias Comerford - Newton Highlands MA
Assignee:
Hollis Automation, Inc. - Nashua NH
International Classification:
H05K 334
US Classification:
2281801
Abstract:
Contact of a soldered board by a soldering oil supplied from within a solder wave takes place immediately following deposition of molten solder onto the board. The oil causes relocation of solder on and/or removal of excess solder from the underside of the board, and any interconnections, component leads and/or component bodies carried thereon before the solder solidifies as shorts, icicles or bridges.
Preheater For Use In Mass Soldering Apparatus
US Patent:
4446358, May 1, 1984
Filed:
Dec 15, 1981
Appl. No.:
6/330909
Inventors:
Matthias F. Comerford - Newton Highlands MA
Michael G. McCallan - Windham NH
Michael G. McCallan - Windham NH
Assignee:
Cooper Industries, Inc. - Houston TX
International Classification:
F27B 906, F27D 1100, B23K 120
US Classification:
219388
Abstract:
An improved preheater for use in mass soldering apparatus employing a bank of quartz lamp heaters mounted in parabolic reflectors and including switching means for switching the quartz heaters on and off in response to the presence of a circuit board on a conveyor passing through the preheater.
Method And Apparatus For Mass Soldering With Subsequent Reflow Soldering
US Patent:
4600137, Jul 15, 1986
Filed:
Feb 21, 1985
Appl. No.:
6/703735
Inventors:
Matthias F. Comerford - Newton Highlands MA
Assignee:
Hollis Automation, Inc. - Nashua NH
International Classification:
B23K 3102
US Classification:
228102
Abstract:
An improved apparatus and method for mass soldering electrical and electronic components populating both the top and bottom surfaces of substrate circuit boards or the like in a single pass is described. The circuit boards pass through a mass soldering station first, and after a timed interval the circuit boards pass through a solder reflow station. The timed interval allows heat transfer through the circuit boards to reach its maximum.