MARK WESLEY BRANDEMUEHL
Pilots at Fairbrook Dr, Mountain View, CA
License number
California A4660342
Issued Date
Aug 2015
Expiration Date
Aug 2017
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
2709 Fairbrook Dr, Mountain View, CA 94040
Professional information
Method And System For Designing A Probe Card
US Patent:
7593872, Sep 22, 2009
Filed:
Aug 15, 2006
Appl. No.:
11/464760
Inventors:
Benjamin N. Eldridge - Danville CA, US
Mark W. Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Mark W. Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
G06Q 30/00
US Classification:
705 26, 700 96, 700 97, 700117, 700180, 324761, 709203
Abstract:
A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.
Method And System For Designing A Probe Card
US Patent:
7930219, Apr 19, 2011
Filed:
Sep 22, 2009
Appl. No.:
12/564799
Inventors:
Benjamin N. Eldridge - Danville CA, US
Mark W. Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Mark W. Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Assignee:
FormFactor, Inc. - Livermore CA
International Classification:
G06Q 30/00
US Classification:
705 26, 700 96, 700 97, 700117, 700180, 324761, 709203
Abstract:
A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.
Method And System For Designing A Probe Card
US Patent:
2003005, Mar 20, 2003
Filed:
Sep 17, 2001
Appl. No.:
09/954617
Inventors:
Benjamin Eldridge - Danville CA, US
Mark Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Mark Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Assignee:
FormFactor, Inc.
International Classification:
G06F017/60
US Classification:
705/026000
Abstract:
A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.
Probe Card Designed By Automated System
US Patent:
2004018, Sep 16, 2004
Filed:
Mar 26, 2004
Appl. No.:
10/810758
Inventors:
Benjamin Eldridge - Danville CA, US
Mark Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
Mark Brandemuehl - Mountain View CA, US
Stefan Graef - Milpitas CA, US
Yves Parent - San Francisco CA, US
International Classification:
G06F017/60
US Classification:
705/050000
Abstract:
A method and system for designing a probe card from data provided by prospective customers via the Internet is provided. Design specifications are entered into the system by prospective customers and compiled into a database. The collective feasibility of each set of design specifications is determined by an automated computer system and communicated to the prospective customer. If feasible, additional software enables prospective customers to create verification packages according to their respective design specifications. These verification packages further consist of drawing files visually describing the final design and verification files confirming wafer bonding pad data. Verification packages are reviewed and forwarded to an applications engineer after customer approval. An interactive simulation of probe card performance is also provided. Data on probe card performance is incorporated into an overall modeling exercise, which includes not only the probe card, but data on the device(s) under test and wafer, as well as data on automated test equipment.