MARK THOMAS DIMKE
Pilots at Oak Crk Ct, Cedar Rapids, IA
License number
Iowa A5059174
Issued Date
Feb 2016
Expiration Date
Feb 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
4519 Oak Creek Ct NE, Cedar Rapids, IA 52411
Personal information
See more information about MARK THOMAS DIMKE at radaris.comName
Address
Phone
4519 Oak Creek Dr, Cedar Rapids, IA 52411
Professional information
See more information about MARK THOMAS DIMKE at trustoria.com
Senior Mechanical Engineer At Rockwell Collins
Senior Mechanical Engineer At Rockwell Collins
Location:
Cedar Rapids, Iowa Area
Industry:
Electrical/Electronic Manufacturing
Experience:
Rockwell Collins (Public Company; 10,001 or more employees; COL; Aviation & Aerospace industry): Senior Mechanical Engineer, (-) Cytec (Public Company; 10,001 or more employees; Electrical/Electronic Manufacturing industry): Group Manager, Technical Service & ...
Use Of Polyamide Thermal Plastics As Low Cost Electronics Potting Compounds For Munitions Applications
Use Of Polyamide Thermal Plastics As Low Cost Electronics Potting Compounds For Munitions Applications
US Patent:
8640619, Feb 4, 2014
Filed:
Nov 15, 2011
Appl. No.:
13/296373
Inventors:
Mark T. Dimke - Cedar Rapids IA, US
Marty B. McGregor - Robins IA, US
Alan P. Boone - Swisher IA, US
Marty B. McGregor - Robins IA, US
Alan P. Boone - Swisher IA, US
Assignee:
Rockwell Collins, Inc. - Cedar Rapids IA
International Classification:
F42D 1/055
US Classification:
102200, 102293
Abstract:
The present invention is directed to use of a polyamide thermal plastic as a potting compound for potting electronic components (ex. —printed circuit boards) of an electronics assembly which is implemented in a munition. Use of the polyamide thermal plastic as a potting compound allows for a gun-hardened electronics assembly. Use of the polyamide thermal plastic as a potting compound also allows for reworkability. For example, during early testing phases of the electronics assembly, the potting material of the present disclosure may be removable (ex. —such as via a hot solvent bath) from the electronics assembly so that the electronics components may be: examined to determine the cause(s) for low yield during testing; and/or fixed, rather than having to rebuild the entire electronics assembly, thereby promoting lower costs of producing the electronics assembly.