DR. MARK IAN ANDERSON, M.D.
Urology in Tacoma, WA

6195259, Feb 27, 2001

Jul 21, 1999

9/358373

Brian T. Whitman - Seattle WA
Susan F. Smith - Olympia WA
Mark W. Anderson - Olympia WA

Intel Corporation - Santa Clara CA

H05K 716

361725

Disclosed are a hot plug method and a hot plug cartridge assembly for a card component (e. g. , peripheral component interconnect compliant card). The cartridge assembly includes a carrier, a holder for the card component and a lever, the holder and lever being movably retained on the carrier. The lever has a camming surface, and the carrier has a protrusion following on the camming surface. Due to the configuration and positioning of the camming surface, lateral motion of the lever causes vertical movement of the lever and holder, to cause vertical movement of the card component. Lateral motion of the lever after introduction of the cartridge assembly into a system causes the card component to move vertically to cause connector structure of the card component to enter into contact with connectors of a circuit board of the system. The camming surface can be configured and positioned such that connector structure along the edge of the card component progressively enters into electrical contact with electrical connectors of a circuit board of the system. The cartridge assembly includes a lock, for preventing accidental removal of the card component, which is activated and de-activated upon lateral motion of the lever.

7017258, Mar 28, 2006

Jan 26, 2004

10/764976

Michael Z. Eckblad - Auburn WA, US
Mark W. Anderson - Olympia WA, US

Intel Corporation - Santa Clara CA

B23P 19/00

29729, 29739, 29740, 29744, 29757, 29760, 29832, 257718, 257727, 361704, 361719

A system for mounting heatsinks, in particular, high-mass heatsinks, on printed circuit boards, such as motherboards. The mounting system includes a backplate, disposed beneath the motherboard, with pins protruding up through the motherboard, and a linkage assembly, which is fixably attached to a base portion of a heatsink assembly. The linkage assembly includes scoops, for grasping the pins during engagement, and a ratcheting system, for compressing the heatsink and thermal interface material onto the package. The mounting system is designed to effectively distribute the heatsink weight, as well as the forces caused by chronic and dynamic stresses, through, rather than upon the motherboard, such as to a chassis. The mounting system thus alleviates stress cracks, component pullout, solderball stress, and other damaging conditions to the motherboard. The mounting system may be engaged and disengaged without the use of tools.