Mark Galen Johnson
Landscape Architect in Portland, ME
License number
Georgia LA000652
Issued Date
Nov 14, 1984
Renew Date
Oct 1, 1995
Expiration Date
Dec 31, 1996
Category
Landscape Architects
Type
Landscape Architect
Address
Address
Portland, ME
Professional information
Retail Finance Manager With More Than 16 Years In Financial Analysis With Emphasis In Multi Site Budgeting
Position:
Manager Direct to Consumer Finance at Cole Haan
Location:
Portland, Maine Area
Industry:
Retail
Work:
Cole Haan
- Scarborough, Maine since Feb 2005
-
Manager Direct to Consumer Finance
American Airlines
Mar 1993 - Mar 2003
-
Sr. Financial Analyst
Education:
University of Southern Maine 1989 - 1992
BS, Accounting
BS, Accounting
Finisher At Yale Cortage
Position:
Finisher at Yale Cortage
Location:
Portland, Maine Area
Industry:
Warehousing
Work:
Yale Cortage
since Aug 2005
-
Finisher
Landscape Architect At Smrt Inc.
Position:
Senior Landscape Architect at SMRT Inc.
Location:
Portland, Maine Area
Industry:
Architecture & Planning
Work:
SMRT Inc.
since Nov 1994
-
Senior Landscape Architect
Independent Consultant
Jan 1990 - Oct 1994
-
Landscape Architect
Keith French and Associates
Nov 1986 - Jan 1990
-
Landscape Architect
Education:
Virginia Polytechnic Institute and State University 1976 - 1982
Bachelor of Landscape Architecture, Landscape Architecture Brandywine High School, Wilmington, DE 1973 - 1976
Bachelor of Landscape Architecture, Landscape Architecture Brandywine High School, Wilmington, DE 1973 - 1976
Languages:
German (limited)
Senior Engineer For Defect Metrology At Texas Instruments
Position:
Process Engineer for Diffusion and Implant at Texas Instruments
Location:
Portland, Maine Area
Industry:
Semiconductors
Work:
Texas Instruments
since Oct 2012
-
Process Engineer for Diffusion and Implant
Texas Instruments
- South Portland, Maine 2010 - Oct 2012
-
Senior Engineer for Defect Metrology
National Semiconductor
Jun 2011 - Sep 2011
-
Defect Metrology Engineer
Sherpa At Johnson Solutions
Position:
sherpa at johnson solutions
Location:
Portland, Maine Area
Industry:
Security and Investigations
Work:
johnson solutions
-
sherpa
System And Method For Providing Automated Sample Preparation For Plan View Transmission Electron Microscopy
US Patent:
7479399, Jan 20, 2009
Filed:
May 21, 2007
Appl. No.:
11/804896
Inventors:
Mark Alan Johnson - Portland ME, US
Larry W. Mayes - Lewiston ME, US
Larry W. Mayes - Lewiston ME, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 21/00
US Classification:
438 33, 438 68, 438113, 438118, 438460, 438464, 438FOR 386, 267620, 267E23179
Abstract:
A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated diamond sawing tool to expose a cross sectional view of the sample wafer. The sample wafer is removed from the first support stub and rotated to orient the sample wafer for plan view imaging. The rotated sample wafer is then remounted on a second support stub and cut with the automated diamond sawing tool to expose a plan view surface of the rotated sample wafer. The remounted sample wafer is subsequently prepared for focused ion beam (FIB) milling and plan view transmission electron microscopy imaging.
System And Method For Providing Automated Sample Preparation For Plan View Transmission Electron Microscopy
US Patent:
7250318, Jul 31, 2007
Filed:
Jul 30, 2004
Appl. No.:
10/903367
Inventors:
Mark Alan Johnson - Portland ME, US
Larry W. Mayes - Lewiston ME, US
Larry W. Mayes - Lewiston ME, US
Assignee:
National Semiconductor Corporation - Santa Clara CA
International Classification:
H01L 21/00
US Classification:
438 33, 438 68, 438113, 438118, 438460, 438464, 438FOR 386, 257620, 257E23179, 372 46012
Abstract:
A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on a first support stub. Then the sample wafer is cut with an automated diamond sawing tool to expose a cross sectional view of the sample wafer. The sample wafer is removed from the first support stub and rotated to orient the sample wafer for plan view imaging. The rotated sample wafer is then remounted on a second support stub and cut with the automated diamond sawing tool to expose a plan view surface of the rotated sample wafer. The remounted sample wafer is subsequently prepared for focused ion beam (FIB) milling and plan view transmission electron microscopy imaging.
Student At University Of Southern Maine
Location:
Portland, Maine Area
Industry:
Education Management
Education:
University of Southern Maine 2006 - 2007