Inventors:
Mark L. Miller - Chandler AZ
International Classification:
H01G 410, H05K 118, H01B 700
Abstract:
A high dielectric sheet material comprises a monolayer of spaced high dielectric chips (e. g. , ceramic single layer capacitor or SLC chips) which have been located or placed within spaced openings or windows formed in a dielectric spacer sheet. Top and bottom conductive sheets, preferably metallic foil sheets, are adhesively placed in intimate mechanical and electrical contact with the respective top and bottom external surfaces of the chips and dielectric spacer sheet. An adhesive is interposed between the metallic foil sheets and the dielectric spacer sheet (filled with high dielectric chips) such that the adhesive material holds the substrate together without interfering with electrical contact between the high dielectric chips and top and bottom foil sheets. This is preferably accomplished through the use of roughened surfaces formed on both the foil sheets and external high dielectric chips. The resultant high dielectric sheet material of this invention is drillable, platable, printable, etchable, laminable and highly reliable.