MARK C JOHNSON, MD
Marriage and Family Therapists in Boise, ID

5925384, Jul 20, 1999

Apr 25, 1997

8/845603

Todd O. Bolken - Meridian ID
Mark S. Johnson - Boise ID

Micron Technology, Inc. - Boise ID

B29C 3104, B29C 4502

425116

A manual loader for use in bypassing an automatic pellet feeder for an automold machine used to encapsulate integrated circuit assemblies in plastic. The loader has a support mounted adjacent the mold section of the machine. The loader also has at least one pellet boat which moves relative to the support into and out of said mold section. The pellet boat includes one or more pellet pots which are adapted to receive and hold a solid pellet of material. The loader has a release mechanism which is movable between a blocking position and a release position. The release mechanism retains the pellets in the pellet pots in the blocking position and releases the pellets from the pots when manipulated to the release position for dropping the pellets into a mold of the machine's mold section.

6549821, Apr 15, 2003

Feb 26, 1999

09/259142

Warren M. Farnworth - Nampa ID
Mark S. Johnson - Boise ID

Micron Technology, Inc. - Boise ID

G06F 1900

700120, 700119, 264163, 26427214, 26427215, 26427217

A stereolithographic method and apparatus for applying packaging material to workpieces such as preformed electronic components, including semiconductor dice, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a stereolithographic system for application of material so that the system may recognize the position and orientation of workpieces, such as semiconductor dice, to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes stereolithographic application of material for packaging electronic components, and the electronic components so packaged are also part of the invention.

6605331, Aug 12, 2003

Sep 1, 1999

09/388045

Mark S. Johnson - Boise ID
Todd O. Bolken - Meridian ID

Micron Technology, Inc. - Boise ID

B32B 302

428 76, 428 357, 425116, 425117, 425127, 4251291

A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

6601294, Aug 5, 2003

Sep 29, 2000

09/672690

Tongbi Jiang - Boise ID
Mark S. Johnson - Boise ID

Micron Technology, Inc. - Boise ID

H05K 330

29841, 29840, 29848, 26427211, 361717

A semiconductor package with thermally enhanced properties is described. The semiconductor package includes a substrate upon which a die is affixed. The die and the substrate each have contacts which are respectively connected with each other. A heat sink is affixed to a surface of the die by way of a thermally compliant material. The compliant material reduces the stresses caused by temperature fluctuations which cause the heat sink and the die to expand and contract at different rates. A first molding material is deposited around the periphery of the die, compliant material and heat sink, thereby leaving exposed substantially an entire surface of the heat sink.

6632575, Oct 14, 2003

Aug 31, 2000

09/654107

Mark S. Johnson - Boise ID

Micron Technology, Inc. - Boise ID

G03F 900

430 5, 430 22

A fiducial includes complementary patterns that are situated symmetrically about a common axis. The complementary patterns permit location of the common axis as an axis that is equidistant from the complementary patterns. The complementary patterns are displaced from the common axes by different distances so that the common axis is located using the complementary patterns nearest the common axis to accurately locate the common axis. The complementary patterns include etch-compensation features that permit the common axis to be accurately located even if an etch process defines the fiducial and the etch process exhibits a process error or variation such as underetching or overetching. The fiducial may be produced by transferring a fiducial pattern from a mask such as a photomask. The fiducial pattern may also be defined on the mask using a computer-aided design program.

7151013, Dec 19, 2006

Oct 1, 2002

10/260615

David J. Corisis - Meridian ID, US
Mike Brooks - Caldwell ID, US
Mark S. Johnson - Boise ID, US
Larry D. Kinsman - Boise ID, US

Micron Technology, Inc. - Boise ID

H01L 21/44

438127, 438122, 438124, 257666, 257787, 257E25011

A high density semiconductor package with thermally enhanced properties is described. The semiconductor package includes a pair of lead frames, each being attached to a respective semiconductor die. The dies are attached to respective lead frames via an adhering material, such as a tape. Further, the dies are each electrically connected to fingers of each lead frame. In one illustrated embodiment, the dies and portions of the fingers are encapsulated in such a way as to leave one surface of each die exposed. In another illustrated embodiment, heat dissipation for the semiconductor package occurs through exposed fingers of the lead frames which adhere semiconductor dies within a cavity located therebetween.

7608788, Oct 27, 2009

Oct 9, 2007

11/869204

Mark S. Johnson - Boise ID, US

Micron Technology, Inc. - Boise ID

H01R 12/04, H05K 1/11

174261

The present invention relates generally to a plating buss design and method for minimizing short circuit problems in PCB panel singulation. More particularly, the invention encompasses a serpentine plating buss which increases the PCB singulation process window thereby minimizing short circuit problems due to indexing errors caused by occasional manufacturing and equipment alignment problems. The serpentine plating buss design therefore increases board yield.

7655508, Feb 2, 2010

Jul 20, 2004

10/894675

Mark S. Johnson - Boise ID, US
Todd O. Bolken - Meridian ID, US

Micron Technology, Inc. - Boise ID

H01L 21/00

438127, 438112, 257E21503

A method of encapsulating an article having first and second surfaces, includes positioning the article on a carrier such that at least a portion of the first surface contacts the carrier. A portion of the carrier carrying the article is then positioned within a mold and a seal is formed between the mold and the carrier. The mold is then filled with an encapsulating material to form a seal between the article and the carrier.