MARK A MACDONALD
Engineering in Beaverton, OR

8634183, Jan 21, 2014

Dec 22, 2010

12/976440

Jered H. Wikander - Portland OR, US
Shawn S. Mceuen - Portland OR, US
Mark MacDonald - Beaverton OR, US
Robert W. Wolcott - Newberg OR, US

Intel Corporation - Santa Clara CA

E05F 1/08, H05K 7/00, H02K 7/00, E05D 11/10

36167901, 36167927, 36167946, 36167955

In one embodiment an electronic device comprises a housing having a first section comprising a display and a second section comprising a keyboard coupled to the first section by a hinge assembly and an automatic hinge opening assembly for the housing. The automat hinge opening assembly comprises a hinge pin assembly mountable to the first section of the housing of the electronic device a pin rotatable about an axis between a first position and a second position and a hinge plate coupled to the pin and connectable to a hinge which connects the first section of the housing to a second section of the housing, and at least one torsion member coupled to the pin to apply a torque to the pin, wherein the torsion member is to store potential energy when the first section of the housing and the second section of the housing are in a closed position. Other embodiments may be described.

2012024, Sep 27, 2012

Mar 25, 2011

13/072488

Mark MacDonald - Beaverton OR, US
Vasudevan Srinivasan - Hillsboro OR, US

F28F 27/00

165278

Embodiments of an apparatus, system and method are described for monitoring an airflow and performing thermal management operations for a mobile computing device. An apparatus may comprise, for example, a heat generating component, an air mover, and a thermal management module to monitor one or more parameters of the air mover and to perform one or more thermal management operations based on one or more changes in the one or more parameters indicating one or more changes in an airflow for the apparatus. Other embodiments are described and claimed.

2013027, Oct 17, 2013

Dec 13, 2011

13/976946

Mark MacDonald - Beaverton OR, US

G06F 1/20, F28D 15/00

36167952, 16510413

Techniques for computing device cooling using a self-pumping cooling fluid are described. For example, an apparatus may comprise one or more heat-generating components, a housing forming a cavity including the one or more heat-generating components, and a self-pumping cooling fluid arranged in the cavity. The self-pumping cooling fluid may comprise a slurry of microencapsulated phase change material (mPCM) particles suspended in a working fluid and arranged to circulate throughout the cavity. Other embodiments are described.

8063382, Nov 22, 2011

Dec 18, 2009

12/641753

Mark MacDonald - Beaverton OR, US
Rajiv K. Mongia - Fremont CA, US

Intel Corporation - Santa Clara CA

H01T 23/00, H05K 7/20

250423R, 250424, 29890035, 361690, 361694, 361231

In one embodiment, an air mover may include a first electrode, a second electrode and an ionization device to selectively ionize molecules in an electric field between the first and second electrodes. The ionized molecules can drive airflow between the first and second electrodes. In certain embodiments, the ionization device has an operational characteristic that prevents ionization of oxygen so that the airflow is ozone-free.

2012016, Jun 28, 2012

Dec 23, 2010

12/978392

Mark MacDonald - Beaverton OR, US
Rajiv K. Mongia - Santa Clara CA, US

G06F 1/20

36167946

Embodiments of the invention are directed towards passive cooling systems for handheld mobile computing devices. An electro-hydrodynamic air mover (EAM) may be included in a handheld mobile computing device, the EAM to include an inlet and an outlet. The inlet and outlet are each included in at least one surface side of the handheld mobile computing device.In embodiments of the invention the EAM produces an airflow by accelerating charged particles surrounding an electrode near the inlet towards an second electrode near the outlet in response to an electric field applied to the electrodes. The airflow will result from air drawn into the inlet of the EAM (i.e., air external to the computing device) and air expelled from the outlet of the EAM (i.e., air expelled away from the computing device).

2008015, Jul 3, 2008

Dec 30, 2006

11/618754

Mark MacDonald - Beaverton OR, US

F25D 17/06

62 89

A cooling system may include a fan which may be placed near the center of the system board. The fan may include bottom inlet and may draw air through an opening in the bottom skin of the computer system and may generate a positive pressure within the computer system. Exhaust vents may be positioned at the periphery.

7957131, Jun 7, 2011

Dec 23, 2009

12/655147

Rajiv K. Mongia - Fremont CA, US
Mark MacDonald - Beaverton OR, US
Eduardo Hernandez-Pacheco - Beaverton OR, US
Jered H. Wikander - Portland OR, US

Intel Corporation - Santa Clara CA

H05K 7/20

36167946, 36167954, 361704, 361719

An electronic device comprises a housing, at least one heat generating component in the housing, and at least one thermal management device in thermal communication with the at least one heat generating component, wherein the at least one thermal management device selectively allocates heat flow to one or more portions of the housing. Other embodiments may be described.

2012007, Mar 29, 2012

Sep 24, 2010

12/890420

Mark MacDonald - Beaverton OR, US

G06F 1/20, F28F 13/00

3616795, 165122, 36167949, 361695

An apparatus with some embodiments is described having ducts positioned above and below a main device housing to provide cooling air flow to at least a portion of the top and bottom surfaces of the associated computing device. In some embodiments, the device is a mobile computing device. In some embodiments, air may be drawn through inlets located on at least one side of the device. The inlet air may be supplied via upper and lower air ducts to an air mover positioned on an opposite side of the device. In some embodiments, air discharged from the air mover may be supplied to a main housing of the device in which heat producing components may be located. Other embodiments are described.

8605428, Dec 10, 2013

Jul 1, 2011

13/175052

Mark MacDonald - Beaverton OR, US
Shawn S. McEuen - Portland OR, US

Intel Corporation - Santa Clara CA

H05K 7/20

36167949, 36167947, 361695, 165 803, 16510433, 165121, 454184

Some embodiments of an apparatus, system and method are described for a concealed venting thermal solution. An apparatus may comprise an enclosure arranged around one or more heat generating components, a duct arranged around an internal perimeter of the enclosure and a seam inlet arranged around an external perimeter of the enclosure to allow an airflow to enter the duct. Other embodiments are described.

2011007, Mar 31, 2011

Sep 25, 2009

12/567619

Mark MacDonald - Beaverton OR, US
Rajiv Mongia - Fremont CA, US

H05K 7/20, G06F 1/20

165185, 165122

A system, apparatus and method for cool touch housings are described. The apparatus may include a housing arranged to at least partially enclose at least one internal component of a mobile device. A portion of the housing may include an exterior surface spreader, a thin active heat pump with a first side and a second side, wherein the first side of the thin active heat pump is thermally coupled to the exterior surface spreader, and an interior surface spreader thermally coupled to the second side of the thin active heat pump. Other embodiments are described and claimed.