MARCIO LOPES
Electrician in Framingham, MA
License number
Massachusetts 22287
Issued Date
Nov 2, 2016
Expiration Date
Jul 31, 2019
Type
Master Electrician
Address
Address
Framingham, MA 01702
Personal information
See more information about MARCIO LOPES at radaris.comName
Address
Phone
4 Universal St, Framingham, MA 01702
301 Union St, Franklin, MA 02038
108 Eliot St, Natick, MA 01760
108 Eliot St, Ashland, MA 01721
16 Depot St, Milford, MA 01757
Organization information
See more information about MARCIO LOPES at bizstanding.comMarcio Lopes
7 Weld St, Framingham, MA 01702
Phone:
(774) 244-1337 (Phone)
In Business Since:
2015
Categories:
Electrical
Specialties:
Telephone Jack & Wiring Install, Telephone System Install, Telephone System Repair, ...
Service area:
Framingham, Wellesley, Southborough, Medway, Westborough, Woodville, Natick, Ashland, Hopkinton
License:
Journeyman Electrician License #53572 expiration date Jul 31, 2016.
Business facts:
Free Estimates, Bilingual
Expertise:
Electrical
Professional information
See more information about MARCIO LOPES at trustoria.com
Method For Removing Electrical Components From Printed Circuit Boards
Method For Removing Electrical Components From Printed Circuit Boards
US Patent:
5326016, Jul 5, 1994
Filed:
Apr 15, 1993
Appl. No.:
8/047024
Inventors:
Marvin S. Cohen - Framingham MA
Marcio A. Lopes - Framingham MA
Marcio A. Lopes - Framingham MA
International Classification:
B23K 100, B23K 1018
US Classification:
228264
Abstract:
A method for removing an individual surface mounted electrical component from a printed circuit board retaining a plurality of other components. The individual component has a plurality of leads connected to circuitry on said board by a connection alloy comprising at least two constituent metals and having a given melting point less than that of either of said constituent metals. The method includes the steps of obtaining a removal alloy composed of a plurality of constituent metals and having a particular melting point below the given melting point; heating the removal alloy to a temperature greater than the particular melting point but below the given melting point so as to produce a molten state thereof; contacting the connection alloy on all of the leads with the molten removal alloy and causing thereby a reaction producing a molten state for the connection alloy; and separating the individual component from the printed circuit board while retaining thereon the other components.