LOGAN HEDIN
Pilots at Peralta Ave, San Francisco, CA

License number
California A5098313
Issued Date
Nov 2012
Expiration Date
Nov 2017
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
740 Peralta Ave, San Francisco, CA 94110

Personal information

See more information about LOGAN HEDIN at radaris.com
Name
Address
Phone
Logan Hedin, age 46
25 Belvedere St, San Francisco, CA 94117
Logan Hedin, age 46
1804 Cedar St, Berkeley, CA 94703
(510) 841-8746

Professional information

Logan Hedin Photo 1

Thermally Conductive Polymer Based Printed Circuit Board

US Patent:
2010001, Jan 21, 2010
Filed:
Jul 13, 2009
Appl. No.:
12/501989
Inventors:
Logan Brook Hedin - San Francisco CA, US
David Michael Miller - Portola Valley CA, US
International Classification:
H05K 1/00
US Classification:
174252
Abstract:
A printed circuit board has a liquid crystalline polymer layer that is bonded to an electrically conductive layer that includes traces that electrically connect components mounted on the printed circuit board. The liquid crystalline polymer material is thermally conductive and dielectric. When the components produce heat, the liquid crystalline polymer layer absorbs and dissipates the heat produced by the electrical components mounted on the printed circuit board. The thermal equilibrium of the printed circuit board is lower than the maximum operating temperature of the components.


Logan Hedin Photo 2

Thermally Conductive Printed Circuit Boards

US Patent:
2014002, Jan 23, 2014
Filed:
Jul 16, 2013
Appl. No.:
13/943588
Inventors:
Nicholas Ryan Conley - Redwood City CA, US
Logan Brook Hedin - San Francisco CA, US
David Michael Miller - Portola Valley CA, US
International Classification:
H05K 1/02
US Classification:
174252, 15624411, 427 984, 264104
Abstract:
A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications.