Inventors:
Nicholas Ryan Conley - Redwood City CA, US
Logan Brook Hedin - San Francisco CA, US
David Michael Miller - Portola Valley CA, US
International Classification:
H05K 1/02
US Classification:
174252, 15624411, 427 984, 264104
Abstract:
A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications.