Inventors:
Liang Wang - Austin TX, US
Michael R. Bruce - Austin TX, US
Assignee:
Globalfoundries Inc. - Grand Cayman
International Classification:
H01L 21/44, H01L 21/66
US Classification:
438 14, 438652, 438 10, 438462, 438597, 438621, 438637, 438672, 438700, 438706, 438704, 438743, 257E21219, 257E21252, 257E21309, 257E21347
Abstract:
Various semiconductor devices and methods of testing such devices are disclosed. In one aspect, a method of manufacturing is provided that includes forming a bore from a backside of a semiconductor chip through a buried insulating layer and to a semiconductor device layer of the semiconductor chip. A conductor structure is formed in the bore to establish an electrically conductive pathway between the semiconductor device layer and the conductor structure. The conductor structure may provide a diagnostic pathway.