DR. LI LI, M.D.
Medical Practice at Coit Rd, Plano, TX
License number
Texas BP1-0027266
Category
Student, Health Care
Type
Student in an Organized Health Care Education/Training Program
License number
Texas D0069290
Category
Medical Practice
Type
Pediatrics
License number
Texas N9464
Category
Medical Practice
Type
Pediatrics
Address
Address
6833 Coit Rd STE 102, Plano, TX 75024
Phone
(972) 268-7068
Professional information
Li Li - Plano, TX
Work:
Dr. Habib Lab
Dr. Habib Lab
Research Senior Scientist Southwestern Medical Center at Dallas - Dallas, TX
Research Scientist U.T. Southwestern Medical Center - Dallas, TX
Research Senior Scientist U.T. Southwestern Medical Center - Dallas, TX
Research Instructor U.T. Southwestern Medical Center - Dallas, TX
Research Scientist U.T. Southwestern Medical Center - Dallas, TX
Associate Research Scientist Columbia University
Postdoctoral Research Fellow U.T. Southwestern Medical Center - Dallas, TX
Postdoctoral Research Fellow Postdoctoral Research Fellowship - Dallas, TX
Research Fellow Division of Plastic Surgery
Attending Surgeon Division of Plastic Surgery
Research Fellow Division of Plastic Surgery
Resident
Research Senior Scientist Southwestern Medical Center at Dallas - Dallas, TX
Research Scientist U.T. Southwestern Medical Center - Dallas, TX
Research Senior Scientist U.T. Southwestern Medical Center - Dallas, TX
Research Instructor U.T. Southwestern Medical Center - Dallas, TX
Research Scientist U.T. Southwestern Medical Center - Dallas, TX
Associate Research Scientist Columbia University
Postdoctoral Research Fellow U.T. Southwestern Medical Center - Dallas, TX
Postdoctoral Research Fellow Postdoctoral Research Fellowship - Dallas, TX
Research Fellow Division of Plastic Surgery
Attending Surgeon Division of Plastic Surgery
Research Fellow Division of Plastic Surgery
Resident
Dying Gasp Charge Controller
US Patent:
7940118, May 10, 2011
Filed:
Nov 11, 2009
Appl. No.:
12/616549
Inventors:
Li Li - Plano TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G05F 1/10
US Classification:
327536
Abstract:
In many applications, “dying gasp” periods following power down are used. Conventional circuits supply energy for the “dying gasp” periods generally by use of large external capacitors that are bulky and expensive. Here, a dying gasp charge controller is employed that allows for the use of smaller capacitors at higher voltages, which maintains or exceeds the energy storage capacities of conventional circuits.
Pre-Bias Control For Switched Mode Power Supplies
US Patent:
2012002, Feb 2, 2012
Filed:
Jul 29, 2010
Appl. No.:
12/846370
Inventors:
Baoson Nguyen - Garland TX, US
Rex M. Teggatz - Sachse TX, US
Li Li - Plano TX, US
Rex M. Teggatz - Sachse TX, US
Li Li - Plano TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H02M 1/36
US Classification:
363 49
Abstract:
An embodiment of the invention provides a method of reducing a drop in voltage on a pre-biased output of a DC-DC step-down switching converter. A high side switch is activated to conduct a first current to the pre-biased output. After the high side switch is activated, a low side switch is activated to draw a second current from the pre-biased output such that the magnitude of the first current is greater than the magnitude of the second current for at least a portion of a time period T. After the time period T ends, the magnitudes of the first and second currents are changed to maintain a predetermined voltage on the pre-biased output.
Li Li
Work:
Huawei Device North America - Plano, TX
Director of Marketing & Field Sales Ever Win International Corp - Los Angeles, CA
Product Marketing Manager Kangxin Partners, P.C., Beijing, China - San Francisco, CA
Senior Marketing Manager
Director of Marketing & Field Sales Ever Win International Corp - Los Angeles, CA
Product Marketing Manager Kangxin Partners, P.C., Beijing, China - San Francisco, CA
Senior Marketing Manager
Education:
Exeter University, School of Business and Economics - Exeter
Master's in Marketing and Finance Exeter University, School of Law - Exeter
Master's in International Business Law China Agriculture University
Bachelor in Economics Law
Master's in Marketing and Finance Exeter University, School of Law - Exeter
Master's in International Business Law China Agriculture University
Bachelor in Economics Law
Method And Packaging Structure For Optimizing Warpage Of Flip Chip Organic Packages
US Patent:
6747331, Jun 8, 2004
Filed:
Jul 17, 2002
Appl. No.:
10/197335
Inventors:
William Infantolino - Vestal NY
Li Li - Plano TX
Steven G. Rosser - Owego NY
Sanjeev Balwant Sathe - Binghamton NY
Li Li - Plano TX
Steven G. Rosser - Owego NY
Sanjeev Balwant Sathe - Binghamton NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 3100
US Classification:
257457, 257108, 257106
Abstract:
An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.
Zero Insertion Force Compliant Pin Contact And Assembly
US Patent:
6565367, May 20, 2003
Filed:
Jan 17, 2001
Appl. No.:
09/764466
Inventors:
Mark Budman - Vestal NY
Bruce Chamberlin - Vestal NY
Li Li - Plano TX
James Stack - Endicott NY
Bruce Chamberlin - Vestal NY
Li Li - Plano TX
James Stack - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 1200
US Classification:
439 82, 439161, 439479, 439567
Abstract:
A compliant pin contact and assembly utilizing same in which the contact is comprised of two layers, each of a different material and coefficient of thermal expansion (CTE) than the other, to enable insertion within an opening in either a âcoldâ or âhotâ state to thereby expand and positively engage the openings walls, thereby securedly holding the pin in position. Representative materials include Invar and aluminum.
Electronic Package Having A Thermal Stretching Layer
US Patent:
6992379, Jan 31, 2006
Filed:
Sep 5, 2001
Appl. No.:
09/947098
Inventors:
David J. Alcoe - Vestal NY, US
Li Li - Plano TX, US
Sanjeev B. Sathe - Binghamton NY, US
Li Li - Plano TX, US
Sanjeev B. Sathe - Binghamton NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/053, H05K 1/03
US Classification:
257700, 257738, 257758, 257778, 257780, 257786, 174 521, 174255, 174256
Abstract:
An electronic package and method of making same in which a circuitized substrate having a first stiffness includes a plurality of electrically conductive circuit members on a first portion of the circuitized substrate and is adapted for having solder connections thereon and for being electrically connected to a semiconductor chip. A stiffener layer having a second stiffness is positioned on a second portion of the circuitized substrate relative to the first portion, the second stiffness of the stiffener layer distributing a portion of the first stiffness of said circuitized substrate so as to substantially prevent failure of the solder connections between the electrically conductive circuit members and the semiconductor chip during operation of the electronic package.
Method And Packaging Structure For Optimizing Warpage Of Flip Chip Organic Packages
US Patent:
7026706, Apr 11, 2006
Filed:
Feb 4, 2004
Appl. No.:
10/771728
Inventors:
William Infantolino - Vestal NY, US
Li Li - Plano TX, US
Steven G. Rosser - Owego NY, US
Sanjeev Balwant Sathe - Binghamton NY, US
Li Li - Plano TX, US
Steven G. Rosser - Owego NY, US
Sanjeev Balwant Sathe - Binghamton NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/48
US Classification:
257678, 257737, 257778, 438108, 438106, 438457
Abstract:
An electronic packaging structure and method of forming thereof wherein the structure is constituted of a modular arrangement which reduces stresses generated in a chip, underfill, and ball grid array connection with a flexible substrate in the form of an organic material, which stresses may result in potential delamination due to thermally-induced warpage between the components of the modular arrangement.