LI LI, FNP
Nursing at Mercy Rd, Gilbert, AZ

6451127, Sep 17, 2002

Jun 1, 1999

09/323464

Li Li - Gilbert AZ
Treliant Fang - Chandler AZ

Motorola, Inc. - Schaumbrug IL

B23K 35363

148 23, 148 24

A conductive paste composition is described which comprises an alloy of tin and a flux composition. The flux composition comprises an aromatic carboxylic acid fluxing agent and a polymeric solvent.

6669079, Dec 30, 2003

Aug 2, 2002

10/211631

Li Li - Gilbert AZ
Treliant Fang - Chandler AZ

Motorola, Inc. - Schaumburg IL

B23K 3526

2282629, 148 23, 148 24

A conductive paste ( ) for use in making conductive bumps ( ) and a method for using the conductive paste to make conductive bumps ( ) on a substrate ( ). The conductive paste ( ) is formed by combining a tin alloy with a flux composition containing an aromatic carboxylic acid fluxing agent and a solvent. The conductive paste ( ) is disposed on underbump metallization layers ( ) and reflowed to form the conductive bumps ( ).

6352192, Mar 5, 2002

Feb 29, 2000

09/515185

Tien-Yu Tom Lee - Phoenix AZ
James Vernon Hause - Maricopa AZ
Li Li - Gilbert AZ

Motorola, Inc. - Schaumburg IL

B23K 1005

228102, 228105, 2282621, 2281801

A system ( ) and method are used for predicting and controlling the temperature of a semiconductor wafer ( ) during a solder reflow process by controlling the operating profile of a solder reflow furnace ( ). The emissivity of the surface of the wafer ( ) is measured using an infrared device ( ) prior to the solder reflow process. Using the measured emissivity value of the wafer ( ), the peak temperature of the wafer ( ) is predicted, and the operating profile of the solder reflow furnace ( ) is adjusted accordingly to achieve a desired temperature profile of the wafer ( ). A process for reflowing solder on a semiconductor wafer calculates a predicted peak temperature of a semiconductor wafer ( ) and controls the actual temperature of the wafer ( ) during a solder reflow process by controlling the operating profile of a solder reflow furnace ( ).

6310403, Oct 30, 2001

Aug 31, 2000

9/652620

Chunsheng Zhang - Chandler AZ
Jong-Kai Lin - Chandler AZ
Scott E. Lindsey - Mesa AZ
Yifan Guo - Gilbert AZ
Li Li - Gilbert AZ

Motorola, Inc. - Schaumburg IL

H01L 2348, H01L 2352, H01L 2940

257786

A method of manufacturing components includes providing a substrate (110, 531, 631, 700) having a first coefficient of thermal expansion (CTE), having a first surface (111), and supporting a first plurality of interconnects located over the first surface in a first predetermined pattern. The method also includes providing another substrate (190) having a second CTE, having a second surface (195), and supporting a second plurality of interconnects located over the second surface in a second predetermined pattern. The method further includes assembling together the two substrates at a first temperature outside of a temperature range of approximately 25 to 30. degree. C.

6841736, Jan 11, 2005

Sep 26, 2002

10/256789

Li Li - Gilbert AZ, US

Motorola, Inc. - Schaumburg IL

H01B 708

174117FF, 174117 R, 174117 AS

An embodiment of a current-carrying structure () includes a first electrically conductive layer () and a second electrically conductive layer (). The second electrically conductive layer is in contact with the first electrically conductive layer along substantially the entire length of the first electrically conductive layer. The second electrically conductive layer is above the first electrically conductive layer. A non-electrically conductive layer () is in contact with the first electrically conductive layer and the second electrically conductive layer. A current travels simultaneously through the first electrically conductive layer and the second electrically conductive layer.