LARRY NELSON SCHMIDT
Engineers in Ardsley, PA

License number
Pennsylvania PE035846E
Category
Engineers
Type
Professional Engineer
Address
Address
Ardsley, PA 19038

Professional information

Larry Schmidt Photo 1

Larry Schmidt - Glenside, PA

Work:
Impact Thrift Stores
Assistant Category Manager and Online Sales Manager for Media
Merck & Company, Incorporated - West Point, PA
Investigator/ Engineer
SILICON POWER COPORATION - Malvern, PA
Process Engineer
VISTEON CORPORATION (formerly Ford Motor Company) - Lansdale, PA
Advanced Manufacturing Engineer
FORD MOTOR COMPANY - Lansdale, PA
Automation Manufacturing Engineer
SCOTT PAPER COMPANY - Chester, PA
Project Engineer
Education:
The Pennsylvania State University, Great Valley
Certificate in Project Management
The Pennsylvania State University, State College
B.S. in Mechanical Engineering
Skills:
Quality; solder joint reliability, ISO 1400 & 16949, 8D problem solving, Statistical Process Control<br/><br/>Experience with Machine acceptance (gage capability, Mini tab), Microsoft Office, Pharmaceutical cGMP, Cold Vault Validation, DeltaV monitoring system, SensiTech ColdStream CCM, TSA clearance, SAP, Lean automation, Customer First, Project Management, Achieve Win/Win, Responsible leadership, Surface Mount Technology.


Larry Schmidt Photo 2

Larry Schmidt - Glenside, PA

Work:
IMPACT THRIFT STORES - Montgomeryville, PA
Assistant Category Manager and Online Sales Manager for Media
MERCK & COMPANY, INCORPORATED - West Point, PA
Investigator/ Engineer
SILICON POWER CORPORATION - Malvern, PA
Process Engineer
FORD MOTOR COMPANY / VISTEON CORPORATION
Advanced Manufacturing Engineer
FORD MOTOR COMPANY / VISTEON CORPORATION - Lansdale, PA FORD MOTOR COMPANY / VISTEON CORPORATION
Automation Manufacturing Engineer
Education:
The Pennsylvania State University, Great Valley
Certificate in Mechanical Engineering License
The Pennsylvania State University, State College
B.S. in Mechanical Engineering


Larry Schmidt Photo 3

Vector Transient Reflow Of Lead Free Solder For Controlling Substrate Warpage

US Patent:
7026582, Apr 11, 2006
Filed:
May 7, 2003
Appl. No.:
10/431258
Inventors:
Lakhi N. Goenka - Ann Arbor MI, US
Peter J. Sinkunas - Canton MI, US
Larry N. Schmidt - Glenside PA, US
Sherwin T. Moss - Philadelphia PA, US
Assignee:
Visteon Global Technologies, Inc. - Dearborn MI
International Classification:
F27D 11/00, F27B 9/06, B23K 31/02
US Classification:
219400, 219388, 219390, 219391, 219412, 2282332
Abstract:
A system and method for reflowing lead-free solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, and a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder.