Kuang-Yu Wang
Engineers in Saratoga, CA

License number
Colorado 24492
Issued Date
Jul 11, 1986
Renew Date
Jun 1, 2011
Expiration Date
Oct 31, 2013
Type
Professional Engineer
Address
Address
Saratoga, CA 95070

Professional information

Kuang-Yu Wang Photo 1

13-Pin Socket For Combination Sd/Mmc Flash Memory System

US Patent:
7009846, Mar 7, 2006
Filed:
Jul 30, 2004
Appl. No.:
10/903939
Inventors:
Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
I-Kang Yu - Palo Alto CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
H05K 7/02
US Classification:
361737, 361752, 439945, 235492
Abstract:
A socket having thirteen contact springs arranged in a manner that supports existing MMC and SD form factors, and also supports a combination SD/MMC flash memory card. The combination memory card includes a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The contacts springs of the socket are arranged to make contact with the modified pad pattern, but to also be backward compatible with existing SD and MMC form factors. A system including the socket and combination SD/MMC flash memory card is also disclosed.


Kuang-Yu Wang Photo 2

Manufacturing Method For Memory Card

US Patent:
7941916, May 17, 2011
Filed:
Jul 8, 2004
Appl. No.:
10/888282
Inventors:
Paul Hsueh - Concord CA, US
Jim Ni - San Jose CA, US
Kuang-Yu Wang - Saratoga CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
H05K 3/30
US Classification:
29841, 29830, 29842, 29855, 29412, 29417, 361737
Abstract:
A portable memory card including a molded plastic casing formed over a memory device and other circuits mounted on a substrate such that the molding material extends over side edges of the substrate to provide accurate width and thickness dimensions. Contact pads are formed on a lower surface of the PCBA substrate, which is exposed through a bottom of the casing. The PCBA is fabricated on a substrate carrier, then positioned inside of a mold assembly. During the molding process, a rod extends from an upper portion of the mold assembly and pushes the substrate against the lower surface. A vacuum is then applied to hold the substrate against the lower surface of the mold, and the rod is subsequently withdrawn from the mold cavity during injection of the molten molding material. A single cavity mold assembly provides molding material extends over front and back edges of the memory card.


Kuang-Yu Wang Photo 3

Molded Memory Card Production Using Carrier Strip

US Patent:
7235423, Jun 26, 2007
Filed:
Nov 5, 2004
Appl. No.:
10/982216
Inventors:
Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
Paul Hsueh - Concord CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
H01L 21/98
US Classification:
438107, 438126, 257E217
Abstract:
Plastic casings are simultaneously molded onto several PCBAs attached to a carrier in a closely-spaced arrangement. All edges of each PCBA have integral connecting segments that extend through grooves formed in the associated mold assembly, and are pinched when the molds assembly is closed to precisely and reliably position the PCBA inside of an associated cavity during the molding process. In one embodiment, the PCB substrate is positioned in a bent arrangement to accommodate the use of inexpensive memory devices. Write-protect switches are provided.


Kuang-Yu Wang Photo 4

Extended Secure-Digital (Sd) Devices And Hosts

US Patent:
7934037, Apr 26, 2011
Filed:
Jul 30, 2010
Appl. No.:
12/847965
Inventors:
Kuang-Yu Wang - Saratoga CA, US
I-Kang Yu - Palo Alto CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
G06F 3/00, G06F 13/12, H05K 7/10
US Classification:
710301, 710 11, 710 14, 710 16, 710 62
Abstract:
Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.


Kuang-Yu Wang Photo 5

Removable Flash Integrated Memory Module Card And Method Of Manufacture

US Patent:
7264992, Sep 4, 2007
Filed:
Aug 6, 2004
Appl. No.:
10/913868
Inventors:
Paul Hsueh - Concord CA, US
Jim Ni - San Jose CA, US
Kuang-Yu Wang - Saratoga CA, US
International Classification:
H01L 21/50, H01L 21/48, H01L 21/44, H01L 23/02, H01L 23/498
US Classification:
438106, 438125, 438126, 257679, 257E23064
Abstract:
A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.


Kuang-Yu Wang Photo 6

Extended Secure-Digital (Sd) Devices And Hosts

US Patent:
7836236, Nov 16, 2010
Filed:
May 25, 2004
Appl. No.:
10/854004
Inventors:
Kuang-Yu Wang - Saratoga CA, US
I-Kang Yu - Palo Alto CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
G06F 3/00, G06F 13/12, H05K 7/10
US Classification:
710301, 710 11, 710 14, 710 16, 710 62
Abstract:
Systems and methods for communicating using various protocols through the Secured Digital (SD) physical interface are disclosed. The invention covers, among others, single-mode and multi-mode hosts, single-mode and multi-mode devices, as well as techniques for initializing these hosts and devices in order to facilitate the aforementioned communication.


Kuang-Yu Wang Photo 7

Combination Sd/Mmc Flash Memory Card With Thirteen Contact Pads

US Patent:
7032827, Apr 25, 2006
Filed:
Jun 18, 2004
Appl. No.:
10/871741
Inventors:
Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
G06K 19/06
US Classification:
235492, 235441
Abstract:
A memory card including a PCB assembly that is consistent with existing 13-pad MMC mechanical form factors, and a housing that is consistent with the SD mechanical form factor, thereby providing a single PCBA and housing arrangement that can be used to produce both MMC and SD memory cards. The thirteen contact pads support all MMC and SD contact pad patterns, but are modified to facilitate a write protect switch. The housing includes an enlarged window (or windows) that exposes two or more contact pads in each of the multiple rows, thereby facilitating slidable insertion of the memory card into a socket of a host system. Alignment notches are formed in the side edges of the PCB, and/or alignment pins are utilized for properly aligning the PCBA within the housing.


Kuang-Yu Wang Photo 8

Card-Type Electronic Apparatus Assembly Using Ultrasonic Joining

US Patent:
7433196, Oct 7, 2008
Filed:
Apr 14, 2004
Appl. No.:
10/825713
Inventors:
Kuang-Yu Wang - Saratoga CA, US
Paul Hsueh - Concord CA, US
Jim Ni - San Jose CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
H05K 5/00
US Classification:
361752, 361800
Abstract:
A card-type electronic apparatus such as an SD card, a CF card, a Memory Stick card, or a USB flash drive is formed from an upper and lower cover that are bonded together at an interior seam formed using ultrasonic joining. Lower sidewalls on the lower cover create an installation pocket for the upper cover. The installation pocket not only simplifies alignment between the upper and lower covers, but also contains any bonder material overflow that might otherwise affect the external dimensions of the apparatus housing. The lower sidewalls can completely surround the upper cover, for drop in installation. Alternatively, the lower sidewalls can partially surround the upper cover, so that the upper cover can be slid into place during assembly.


Kuang-Yu Wang Photo 9

Portable Computer Peripheral Apparatus With Reinforced Connecting Ring

US Patent:
7035110, Apr 25, 2006
Filed:
Oct 12, 2004
Appl. No.:
10/964412
Inventors:
Kuang-Yu Wang - Saratoga CA, US
Jim Ni - San Jose CA, US
Edward W. Lee - Mountain View CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
H05K 5/02
US Classification:
361737, 361752
Abstract:
A computer peripheral device including a USB plug connector in which a reinforced connecting ring is mounted over the front flange of a two-part housing, and includes an opening through which the USB plug connector protrudes. The connecting ring includes a collar that is sized to mount over the front flange using an interference fit. The connecting ring also includes a front plate that protects a front of the housing from damage during use. An optional rear connecting ring is used to further secure the housing together.


Kuang-Yu Wang Photo 10

System And Method For Providing A Flash Memory Assembly

US Patent:
7394661, Jul 1, 2008
Filed:
Jun 30, 2004
Appl. No.:
10/882539
Inventors:
Kuang-Yu Wang - Saratoga CA, US
Charles C. Lee - Sunnyvale CA, US
Assignee:
Super Talent Electronics, Inc. - San Jose CA
International Classification:
H05K 5/03
US Classification:
361737, 361752, 174 5052, 439135
Abstract:
The present invention relates to a method and system for providing a flash memory assembly. The flash memory assembly includes a connector and a printed circuit board (PCB) coupled to the connector. The center of the PCB is positioned substantially at the center of the connector. An electronic component is coupled to one side of the PCB. In another aspect of the present invention, a second electronic component is coupled to a second side of the PCB. In another aspect of the present invention, the electronic components and the PCB are protected by covers joined using interference fitting or ultrasonic joining. In another aspect of the present invention, a cap protects the connector. The cap can be removably coupled to the connector.