Inventors:
Timothy B. Bambridge - Pittstown NJ, US
Juan A. Herbsommer - Schnecksville PA, US
Osvaldo Lopez - Lebanon NJ, US
Joel M. Lott - Quakertown PA, US
Khanh C. Nguyen - Macungie PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H03F 3/14, H05K 1/18
Abstract:
An amplifier module has a substrate, as assembly having one or more integrated circuit (IC) dies mounted to the substrate, and one or more other electronic components mounted to the substrate. The assembly receives an input signal and generates an amplified output signal. The one or more other electronic components perform one or more amplifier-related functions. The amplifier module is adapted to be mounted to a circuit board (CB) as a distinct electronic package. The invention may be implemented as an electronic system having the CB and at least one such amplifier module mounted to the CB.