KEVIN Y CHEN, PHARMD
Pharmacy at Washington St, San Diego, CA
License number
California 54910
Category
Pharmacy
Type
Pharmacist
Address
Address
313 Washington St, San Diego, CA 92103
Phone
(619) 291-7170
(858) 886-7393
(858) 886-7393
Personal information
See more information about KEVIN Y CHEN at radaris.comName
Address
Phone
4388 El Camino Real UNIT 367, Los Altos, CA 94022
4341 Cedar Ave, El Monte, CA 91732
383 Chester Ave, San Francisco, CA 94132
3835 Mistral Dr, Huntington Beach, CA 92649
3818 18Th St APT 1, San Francisco, CA 94114
Professional information
See more information about KEVIN Y CHEN at trustoria.com
Kevin Chen - San Diego, CA
Kevin Chen - San Diego, CA
Work:
UCSD National Geographic Engineers for Exploration
Pediatric Urologist Mentee UCSD National Geographic Engineers for Exploration
Project Lead & Design Engineer UCSD National Geographic Engineers for Exploration - La Jolla, CA
Tech Development Assistant Solar Turbines - San Diego, CA
Package Manufacturing Engineer Intern UCSD National Geographic Engineers for Exploration
Summer Research Intern
Pediatric Urologist Mentee UCSD National Geographic Engineers for Exploration
Project Lead & Design Engineer UCSD National Geographic Engineers for Exploration - La Jolla, CA
Tech Development Assistant Solar Turbines - San Diego, CA
Package Manufacturing Engineer Intern UCSD National Geographic Engineers for Exploration
Summer Research Intern
Education:
University of California - San Diego, CA
Bachelor of Science in Mechanical Engineering
Bachelor of Science in Mechanical Engineering
Sushi Chef, Life Apprentice At Chen Sushi International
Sushi Chef, Life Apprentice At Chen Sushi International
Position:
Sushi Chef, Life Apprentice at Chen Sushi International
Location:
Greater San Diego Area
Industry:
Professional Training & Coaching
Work:
Chen Sushi International
-
Sushi Chef, Life Apprentice
Computer-Implemented Data Storage Systems And Methods For Use With Predictive Model Systems
Computer-Implemented Data Storage Systems And Methods For Use With Predictive Model Systems
US Patent:
2013033, Dec 19, 2013
Filed:
May 30, 2013
Appl. No.:
13/905524
Inventors:
Radu Drossu - San Diego CA, US
Kevin Chaowen Chen - San Diego CA, US
Paul C. Dulany - San Diego CA, US
Kevin Chaowen Chen - San Diego CA, US
Paul C. Dulany - San Diego CA, US
Assignee:
SAS Institute Inc. - Cary NC
International Classification:
G06Q 40/02
US Classification:
705 38
Abstract:
Systems and methods for performing fraud detection. As an example, a system and method can be configured to contain a raw data repository for storing raw data related to financial transactions. A data store contains rules to indicate how many generations or to indicate a time period within which data items are to be stored in the raw data repository. Data items stored in the raw data repository are then accessed by a predictive model in order to perform fraud detection.
Computer-Implemented Data Storage Systems And Methods For Use With Predictive Model Systems
Computer-Implemented Data Storage Systems And Methods For Use With Predictive Model Systems
US Patent:
7912773, Mar 22, 2011
Filed:
Mar 26, 2007
Appl. No.:
11/691277
Inventors:
Revathi Subramanian - San Diego CA, US
Radu Drossu - San Diego CA, US
Kevin Chaowen Chen - San Diego CA, US
Paul C. Dulany - San Diego CA, US
Radu Drossu - San Diego CA, US
Kevin Chaowen Chen - San Diego CA, US
Paul C. Dulany - San Diego CA, US
Assignee:
SAS Institute Inc. - Cary NC
International Classification:
G06Q 40/00
US Classification:
705 35
Abstract:
Systems and methods for performing fraud detection. As an example, a system and method can be configured to contain a raw data repository for storing raw data related to financial transactions. A data store contains rules to indicate how many generations or to indicate a time period within which data items are to be stored in the raw data repository. Data items stored in the raw data repository are then accessed by a predictive model in order to perform fraud detection.
Solvent Assisted Burnishing Of Pre-Underfilled Solder-Bumped Wafers For Flipchip Bonding
Solvent Assisted Burnishing Of Pre-Underfilled Solder-Bumped Wafers For Flipchip Bonding
US Patent:
2007010, May 10, 2007
Filed:
Jan 8, 2007
Appl. No.:
11/620813
Inventors:
Peter Hogerton - White Bear Lake MN, US
Kevin Chen - San Diego CA, US
Joel Gerber - Orono MN, US
Robert Zenner - Minneapolis MN, US
Kevin Chen - San Diego CA, US
Joel Gerber - Orono MN, US
Robert Zenner - Minneapolis MN, US
International Classification:
H01L 23/48, H01L 21/00
US Classification:
257778000, 438108000, 257E21503
Abstract:
The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.
Solvent Assisted Burnishing Of Pre-Underfilled Solder Bumped Wafers For Flipchip Bonding
Solvent Assisted Burnishing Of Pre-Underfilled Solder Bumped Wafers For Flipchip Bonding
US Patent:
7170185, Jan 30, 2007
Filed:
Oct 17, 2000
Appl. No.:
09/690600
Inventors:
Peter B. Hogerton - White Bear Lake MN, US
Kevin Yu Chen - San Diego CA, US
Joel A. Gerber - Orono MN, US
Robert L. D. Zenner - Minneapolis MN, US
Kevin Yu Chen - San Diego CA, US
Joel A. Gerber - Orono MN, US
Robert L. D. Zenner - Minneapolis MN, US
Assignee:
3M Innovative Properties Company - St. Paul MN
International Classification:
H01L 23/52, H01L 23/48, H01L 23/40, H01L 23/485, H01L 23/498
US Classification:
257780, 257778, 257738, 257E23021, 257E23069
Abstract:
The present invention relates to a method for connecting an integrated circuit chip to a circuit substrate. The method includes the step of pre-applying adhesive directly to a bumped side of an integrated circuit chip. The method also includes the steps of removing portions of the adhesive from the tips of the solder bumps to expose a contact surface, and pressing the bumped side of the integrated circuit chip, which has previously been coated with adhesive, against the circuit substrate such that the bumps provide an electrical connection between the integrated circuit chip and the circuit substrate. The adhesive is removed from the tips of the solder bumps using a solvent assisted wiping action. The pre-applied adhesive on the chip forms a bond between the integrated circuit chip and the circuit substrate.