KEVIN T SCHULTZ
Engineering in Saint Paul, MN

6351353, Feb 26, 2002

Dec 9, 1999

09/454206

David A. Sluzewski - Edina MN
David G. Qualey - Apple Valley MN
Kevin J. Schultz - Apple Valley MN

Seagate Technology, Inc. - Scotts Valley CA

G11B 556

3602943, 3602458, 3602345, 3602346

The present invention is a package for incorporating a micromotor into a head gimbal assembly. The head gimbal assembly includes a slider package and a micromotor package assembled on a load beam. The slider package and micromotor package include circuitry which allow a read/write signal to be conducted from the read/write head on the slider to the load beam. Solder joints form the electrical and mechanical connections between the load beam, the micromotor, and the slider.

5711063, Jan 27, 1998

Jun 11, 1996

8/661816

Richard August Budde - Plymouth MN
Kevin Jon Schultz - Apple Valley MN
Daniel E. Glumac - Little Canada MN
Patrick J. Ryan - St. Paul MN
Cal E. Hardie - Edina MN

Seagate Technology, Inc. - Scotts Valley CA

G11B 542

2960306

An apparatus comprising a magnetic head suspension assembly (10) comprised of a rectangular portion (12), load beam (14) and flexure (16) fabricated from a silicon structure using the etching techniques of the integrated circuit fabrication industry. Said magnetic head suspension assembly (10) having electrical leads (23) to a slider, a pre-amp circuit (25) and a microactuator (27) fabricated directly thereon. A system of providing a loading force passing to slider (50) comprising either a tapered base plate (40) adapted to be held by a horizontally oriented actuator arm or an actuator arm (60) having at least one angled receiving surface (62,64) for attachment to said suspension assembly. The method of forming a magnetic head suspension assembly (10) from an etched silicon structure comprising a cutting step comprising cutting said silicon structure into the silhouette shape of a magnetic head suspension assembly, having a rectangular portion (12), a load beam (14) and a flexure (16), said flexure being cut in a shape such that finger members (18), slider bond tongue (19) and dimple tongue (20) appear thereon, and subsequent to said cutting step, the step of photo-etching regions of said silicon structure to reduce thickness of said silicon structure in certain regions, said photo-etching leaving a remaining non-etched small plateau area which is adapted to act as a point or dimple for an attached slider to gimbal about.

5896246, Apr 20, 1999

Apr 21, 1997

8/837604

Richard August Budde - Plymouth MN
Kevin Jon Schultz - Apple Valley MN
Daniel E. Glumac - Little Canada MN
Patrick J. Ryan - St. Paul MN
Cal E. Hardie - Edina MN

Seagate Technology, Inc. - Scotts Valley CA

G11B 548

360104

An apparatus comprising a magnetic head suspension assembly (10) comprised of a rectangular portion (12), load beam (14) and flexure (16) fabricated from a silicon structure using the etching techniques of the integrated circuit fabrication industry. The magnetic head suspension assembly (10) has electrical leads (23) to a slider, a pre-amp circuit (25) and a microactuator (27) fabricated directly thereon. A system of providing a loading force passing to slider (50) comprises either a tapered base plate (40) adapted to be held by a horizontally oriented actuator arm or an actuator arm (60) having at least one angled receiving surface (62,64) for attachment to said suspension assembly. The method of forming a magnetic head suspension assembly (10) from an etched silicon structure comprising a cutting step comprising cutting the silicon structure into the silhouette shape of a magnetic head suspension assembly, having a rectangular portion (12), a load beam (14) and a flexure (16), the flexure is cut in a shape such that finger members (18), slider bond tongue (19) and dimple tongue (20) appear thereon. Subsequent to the cutting step, photo-etching regions of the silicon structure reduces thickness of the silicon structure in certain regions.

2014000, Jan 9, 2014

Jul 9, 2012

13/544067

Jackson W. Brandts - Watertown MN, US
Kevin J. Schultz - Apple Valley MN, US
Christoper M. Unger - St. Louis Park MN, US

Seagate Technology LLC - Cupertino CA

H01B 5/00, H01R 43/02

1741261, 29825

An electrical connection between a first element and a second element formed by a solder ball bridge having at least three solder balls in physical contact with each other extending to electrically connect the first element and the second element. The solder ball bridge is particularly suitable for a disc drive system, to form an electrical connection between two elements such as between a piezoelectric microactuator element and the suspension assembly. Methods of making a solder ball bridge are also provided.

5946163, Aug 31, 1999

May 13, 1997

8/855624

Zine-Eddine Boutaghou - Vadnais Heights MN
Richard Budde - Plymouth MN
Kevin Schultz - Apple Valley MN

Seagate Technology, Inc. - Scotts Valley CA

G11B 548

360104

A flex circuit comprises a flexible carrier and at least one conductor carried by the flexible carrier. The flexible carrier includes a lattice which provides reduced torsional and bending stiffness and reduced thermal expansion properties.