KEVIN M FOLEY, M.D.
Anesthesiologist Assistant at Boise Ave, Loveland, CO
License number
Colorado 32484
Category
Osteopathic Medicine
Type
Anesthesiology
Address
Address
2
2000 Boise Ave, Loveland, CO 80538
PO Box 52631, Phoenix, AZ 85072
PO Box 52631, Phoenix, AZ 85072
Phone
(970) 669-4640
(970) 395-7878
(970) 395-7880 (Fax)
(970) 395-7878
(970) 395-7880 (Fax)
Personal information
See more information about KEVIN M FOLEY at radaris.comName
Address
Phone
5013 N 87Th St, Scottsdale, AZ 85250
555 E Lionshead Cir #208, Vail, CO 81657
4275 N Miller Rd, Scottsdale, AZ 85251
101 Sage Hill Dr, Silverthorne, CO 80498
5975 Rome Ct, Aurora, CO 80015
Professional information
President, Position Sports, Inc.
Position:
President at Position Sports, Inc.
Location:
Phoenix, Arizona Area
Industry:
Marketing and Advertising
Work:
Position Sports, Inc.
since Jun 2005
-
President
Sports America
2000 - 2005
-
Executive Director of Operations
Education:
University of Maryland College Park 1997 - 2000
Milton Academy 1996
Milton Academy 1996
Kevin M Foley, Loveland CO
Specialties:
Anesthesiologist
Address:
2000 Boise Ave, Loveland, CO 80538
Board certifications:
American Board of Anesthesiology Certification in Anesthesiology
Dr. Kevin M Foley, Loveland CO - MD (Doctor of Medicine)
Specialties:
Anesthesiology
Address:
Loveland Anesthesia Associates, PC
2204 Hoffman Dr SUITE A, Loveland 80538
(970) 667-9794 (Phone)
2204 Hoffman Dr SUITE A, Loveland 80538
(970) 667-9794 (Phone)
Certifications:
Anesthesiology, 1994
Awards:
Healthgrades Honor Roll
Languages:
English
Hospitals:
Loveland Anesthesia Associates, PC
2204 Hoffman Dr SUITE A, Loveland 80538
McKee Medical Center
2000 Boise Ave Anx SUITE 1000, Loveland 80538
2204 Hoffman Dr SUITE A, Loveland 80538
McKee Medical Center
2000 Boise Ave Anx SUITE 1000, Loveland 80538
Education:
Medical School
Medical College of Wisconsin
Graduated: 1989
Medical College of Wisconsin
Graduated: 1989
Semiconductor Component
US Patent:
5900669, May 4, 1999
Filed:
Jun 30, 1997
Appl. No.:
8/886100
Inventors:
James H. Knapp - Chandler AZ
Keith E. Nelson - Tempe AZ
Les Ticey - Gilbert AZ
Kevin J. Foley - Phoenix AZ
Keith E. Nelson - Tempe AZ
Les Ticey - Gilbert AZ
Kevin J. Foley - Phoenix AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 2328
US Classification:
257701
Abstract:
A substrate having a vent (20) and a method of forming the vent (20). A substrate (11) has conductive traces (14) and a semiconductor chip attach pad (17) on a top surface and conductive traces (12) and a bonding pad (13) on the bottom surface. A masking layer (18) is formed over the substrate (11) and openings are formed in the masking layer (18) to expose the conductive traces (14) and a semiconductor chip attach pad (17). The vent (20) is formed in the masking layer (18). A semiconductor chip (31) is mounted to the semiconductor chip attach pad (17). During a step of encapsulating the semiconductor chip (31) with a mold compound, the vent (20) provides pressure relief.