DR. KEVIN J WILSON, MD
Marriage and Family Therapists at Milano Dr, Meridian, ID
License number
Idaho M9669
Category
Osteopathic Medicine
Type
Family Medicine
Address
Address
2
3140 W Milano Dr SUITE 150, Meridian, ID 83646
190 E Bannock St, Boise, ID 83712
190 E Bannock St, Boise, ID 83712
Phone
(208) 887-4775
(208) 888-1344 (Fax)
(208) 888-1344 (Fax)
Organization information
See more information about KEVIN J WILSON at bizstanding.comKevin J Wilson
3090 E Gentry Way, Meridian, ID 83642
Industry:
Business Services at Non-Commercial Site
Family Practitioner:
Kevin J Wilson (Family Practitioner)
Professional information
Owner At Kswag Promotions
Position:
Owner at KSWAG Promotions
Location:
Boise, Idaho Area
Industry:
Marketing and Advertising
Work:
KSWAG Promotions
since Aug 2010
-
Owner
Accurate Imprints
Nov 2008 - Jul 2010
-
Sales
FusionSet, Inc.
Sep 2006 - Jul 2008
-
Account Executive
Idaho Cardiology
2003 - 2007
-
Medical Records
Vision One
Aug 2001 - May 2003
-
Operations Manager
LaserSight Technologies, Inc.
May 1999 - Aug 2001
-
International Laser Systems Trainer
Education:
Boise State University 2002 - 2006
Bachelor of Business Administration, Marketing
Bachelor of Business Administration, Marketing
Skills:
Event Marketing, Promotional Products, Schwag, Corporate Gifts, Collateral, Campaigns, Retail, Entrepreneurship, Sales Operations, Cross-functional Team Leadership, Event Planning
Interests:
Golf, live music, Boise State University athletics
Dr. Kevin J Wilson, Meridian ID - MD (Doctor of Medicine)
Specialties:
Family Medicine
Age:
51
Address:
Ten Mile
3140 W Milano Dr, Meridian 83646
(208) 887-4775 (Phone)
3140 W Milano Dr, Meridian 83646
(208) 887-4775 (Phone)
Certifications:
Family Practice, 2006
Awards:
Healthgrades Honor Roll
Languages:
English, Spanish
Hospitals:
Ten Mile
3140 W Milano Dr, Meridian 83646
St. Luke's Regional Medical Center
190 East Bannock St, Boise 83712
3140 W Milano Dr, Meridian 83646
St. Luke's Regional Medical Center
190 East Bannock St, Boise 83712
Philosophy:
Kevin Wilson, MD earned his medical degree from the University of Utah School of Medicine in Salt Lake City and completed his residency at the Family Medicine Residency in Fort Wayne, Indiana. Dr. Wilson's professional interests include all aspects of family medicine, pediatrics, preventive medicine, acute care, sports medicine, and long-term patient relationships.
Education:
Medical School
University of Utah
Graduated: 2003
University of Utah
Graduated: 2003
Non-Lot Based Method For Assembling Integrated Circuit Devices
US Patent:
6400840, Jun 4, 2002
Filed:
Apr 9, 2001
Appl. No.:
09/832163
Inventors:
Kevin Wilson - Boise ID
Ron Hjorth - Boise ID
Ron Hjorth - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G06F 1900
US Classification:
382145, 702187
Abstract:
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i. e. , without breaks between lots).
Nonlot Based Method For Assembling Integrated Circuit Devices
US Patent:
6588854, Jul 8, 2003
Filed:
Apr 5, 2002
Appl. No.:
10/117244
Inventors:
Kevin Wilson - Boise ID
Ron Hjorth - Boise ID
Ron Hjorth - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G06F 1900
US Classification:
302145, 702187
Abstract:
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i. e. , without breaks between lots).
Winch For Snowmobiles
US Patent:
5560441, Oct 1, 1996
Filed:
Jun 7, 1995
Appl. No.:
8/473710
Inventors:
Larry Moody - Boise ID
Kevin S. Wilson - Boise ID
Kevin S. Wilson - Boise ID
International Classification:
B62D 5700
US Classification:
180 75
Abstract:
A winch device for snowmobiles, having a tensile member (34) and a centering harness (36), with tensile member (34) being configured to be removably attached to the track (24) of a snowmobile and centering harness (36) being configured to be removably attached to the front end of the snowmobile. In use, the centering harness provides support for a guide (38) that receives and guides tensile member (34). One end of tensile member (34) attaches to a track (24), and the other end attaches to some solid and secure object. When power is applied to the snowmobile, track (24) rotates, thereby propelling the snowmobile forward along the length of tensile member (34) and toward the solid and secure object to which the tensile member is attached.
Non-Lot Based Method For Assembling Integrated Circuit Devices
US Patent:
7120287, Oct 10, 2006
Filed:
Jul 7, 2003
Appl. No.:
10/614917
Inventors:
Kevin Wilson - Boise ID, US
Ron Hjorth - Boise ID, US
Ron Hjorth - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G06F 19/00
US Classification:
382145
Abstract:
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i. e. , without breaks between lots).
Non-Lot Based Method For Assembling Integrated Circuit Devices
US Patent:
6226394, May 1, 2001
Filed:
Nov 16, 1999
Appl. No.:
9/440736
Inventors:
Kevin Wilson - Boise ID
Ron Hjorth - Boise ID
Ron Hjorth - Boise ID
Assignee:
Micron Tecnology, Inc. - Boise ID
International Classification:
G06F 1900, G06K 710
US Classification:
382145
Abstract:
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i. e. , without breaks between lots).
Non-Lot Based Method For Assembling Integrated Circuit Devices
US Patent:
2007008, Apr 19, 2007
Filed:
Oct 6, 2006
Appl. No.:
11/545059
Inventors:
Kevin Wilson - Boise ID, US
Ron Hjorth - Boise ID, US
Ron Hjorth - Boise ID, US
International Classification:
G06K 9/00
US Classification:
382145000
Abstract:
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i.e., without breaks between lots).
Non-Lot Based Method For Assembling Integrated Circuit Devices
US Patent:
6049624, Apr 11, 2000
Filed:
Feb 20, 1998
Appl. No.:
9/027144
Inventors:
Kevin Wilson - Boise ID
Ron Hjorth - Boise ID
Ron Hjorth - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G06F 1900, G06K 710
US Classification:
382145
Abstract:
An inventive method tracks IC devices through the assembly steps in a manufacturing process. Prior to die attach, a laser scribe marks the lead frame of each of the devices with a coded hole matrix that gives each device a unique ID code. During die attach, an optical hole reader retrieves the ID code of each of the IC devices, and a computer system stores the retrieved ID codes in association with the lot numbers of the ICs attached to the lead frames. The ID codes of the devices are then read at each step in assembly so the devices can be tracked through assembly individually, rather than by lots. As a result, the devices can proceed through assembly in a more efficient, continuous manner (i. e. , without breaks between lots).
Kevin Wilson
Location:
Boise, Idaho Area
Industry:
Food & Beverages