Kenneth Ray Smith
General Contractor in Plano, TX

2002001, Jan 31, 2002

Nov 17, 1998

09/193830

KENNETH R. SMITH - PLANO TX, US
JOHN L. PIERCE - DALLAS TX, US

G01R031/02

324/755000

A system is described for using with fine pitch devices including singulated bare die, semiconductor wafers, chip sized packages, printed circuit boards, and the like to determine that the fine pitch device is not faulty. The system is also usable for transfer of data, energy, for collecting data measurements or measurement-related data between two pieces, and for effecting at least part of an identification process. The disclosed embodiment includes a substrate having a circuit pad pattern in the mirror image of the pattern of contact points, usually bond pads of the fine pitch device to be connected. A conductive elastomeric probe is permanently formed on the circuit pads of the substrate such that the probe is malleable and allows repetitive electrical contact. The system may also contain an alignment template for orienting the fine pitch device onto the elastomeric probes of the contact point pattern of the substrate.

6064217, May 16, 2000

Aug 28, 1996

8/705886

Kenneth R. Smith - Plano TX

EPI Technologies, Inc. - Richardson TX

G01R 3102, H01R 458

324760

A reusable test socket is described for testing fine pitch devices including singulated bare die, semiconductor wafers, chip sized packages, printed circuit boards, and the like to determine that the fine pitch device is not faulty. The socket contains a circuit pad pattern in the mirror image of the pattern of contact points, usually bond pads of the fine pitch device to be tested. Each pad of the socket contains a conductive elastomeric probe which has been "screened" onto the bond pad. The socket also contains an alignment template for orienting the fine pitch device onto the elastomeric probes of the contact point pattern of the test socket. Additionally, the socket can be a singular piece or it can be made of two main pieces; the first being a socket, and the second being a test board designed to mate with the socket. The disclosed invention also includes a method of using the reusable test socket which includes the steps of placing the fine pitch device onto the test socket, placing the socket into electrical continuity with test equipment and conducting electrical tests at ambient as well as elevated temperatures.

5475317, Dec 12, 1995

Apr 21, 1995

8/427974

Kenneth R. Smith - Plano TX

EPI Technologies, Inc. - Richardson TX

G01R 3100

324760

A reusable test socket is described for testing singulated bare die to determine, before packaging, that the bare die is a "known good die". The socket contains a circuit pad pattern in the mirror image of the bond pad pattern of the bare die to be tested. Each pad of the socket contains a conductive elastomeric probe which has been "screened" onto the bond pad. The socket also contains an alignment template for orienting the bare die onto the elastomeric probes of the pad pattern of the test socket. Additionally, the socket can be a singular piece or it can be made of two main pieces; the first being a socket, and the second being a test board designed to mate with the socket. Further, the socket can be utilized in conjunction with a clamp for holding the bare die in place and with a thermoelectric cooler. The thermoelectric cooler is used to heat or cool the die at all temperatures required for military certification and other extended temperature applications. The disclosed invention also includes a method of using the reusable test socket which includes the steps of placing the bare die onto the test socket, placing the socket into electrical continuity with test equipment, conducting tests at ambient temperatures, subjecting the die to a prolonged period of "burn-in" at elevated temperatures, conducting further electrical tests at various temperatures, and determining whether the bare semiconductor die is a "known good die".

4499666, Feb 19, 1985

Jul 6, 1982

6/395787

Kenneth M. Smith - Plano TX

G01B 304

33174B

A framing layout tool facilitates the accurate and quick layout of framing marking for a structure. A bidirectional measuring scale provides a means for measuring and marking the location of any size door or window opening. Window and door marking tabs are also positioned along the main bar of the tool for obtaining markings for window and door openings of predetermined widths. A channel marker extends from the edge of the tool and is of a predetermined width corresponding to the width of the channel. The channel marker includes a central opening for use in conjunction with the outer stud markers for marking studs with spacings greater than the equidistantly spaced stud markers. A plurality of stud markers corresponding in width to a stud are spaced equidistantly along one edge of the layout tool.