KENNETH M COLE
Engineering in Holliston, MA

2003021, Nov 20, 2003

Jun 19, 2003

10/465716

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

H05B003/68

219/444100, 219/544000

A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. In another aspect, the chuck of the invention provides for interchangeable top surface assemblies used to support the workpiece chuck. The thermal plate assembly includes mechanical mounting for the top surface assembly. The mounting is adapted to accept different types of top surface assemblies, depending on the application in which the chuck is being used. The interchangeable nature of the top surface assemblies permits the user to use multiple top surfaces with a single thermal plate. In another aspect of the invention, the negative effects of movements between chuck layers can be mitigated by applying a hard coating such as a hard anodize to one of the surfaces between the top surface assembly and the thermal plate assembly.

2002006, Jun 6, 2002

Jul 6, 2001

09/900285

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

H05B003/68

219/444100

A workpiece chuck used, for example, to support a semiconductor wafer during processing, is described. In one aspect, the chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane. The thermal plate assembly can include a housing made of a cast material such as aluminum. In another aspect, the chuck of the invention provides for interchangeable top surface assemblies used to support the workpiece chuck. The thermal plate assembly includes mechanical mounting for the top surface assembly. The mounting is adapted to accept different types of top surface assemblies, depending on the application in which the chuck is being used. The interchangeable nature of the top surface assemblies permits the user to use multiple top surfaces with a single thermal plate. In another aspect of the invention, the negative effects of movements between chuck layers can be mitigated by applying a hard coating such as a hard anodize to one of the surfaces between the top surface assembly and the thermal plate assembly.

2007024, Oct 18, 2007

Mar 13, 2007

11/717432

Kenneth Cole - Holliston MA, US
Michael Conroy - Attleboro MA, US
Edward Lowerre - Brooklyn NY, US
James Pelrin - Taunton MA, US

Temptronic Corporation - Sharon MA

F25D 9/00

062440000

A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position.

2002006, May 30, 2002

Jan 16, 2002

10/052861

Paul Getchel - Placerville CA, US
Kenneth Cole - Holliston MA, US
Henry Lyden - Wellesley MA, US

F28D015/00, F25B029/00

165/263000, 165/104330

A system for and method of controlling the temperature of a flat workpiece such as a semiconductor wafer are disclosed. The workpiece is mounted on a workpiece chuck which is mounted over a base between the chuck and a host machine such as a wafer prober used to test integrated circuits on a wafer. The chuck includes an upper portion on which the workpiece is mounted. The temperature of the upper portion of the chuck is controlled to control the temperature of the workpiece. The temperature of the base is controlled to reduce the amount of heat flow between the chuck and the host machine. A power and control system includes a switching power supply which provides power to system components including heaters in the chuck used to heat the workpiece. A series of filters removes electrical noise generated by the switching power supply such that low-noise operation is realized.

2005012, Jun 9, 2005

Nov 23, 2004

10/997017

Douglas Hudson - Hopkinton MA, US
James Pelrin - Taunton MA, US
Sanjiv Patel - Bellingham MA, US
Chin Chien Tee - Banting Senagor D.E., MY
Kenneth Cole - Holliston MA, US

F28F007/00, F25B029/00

165253000, 165260000

A system and method for controlling temperature of a workpiece such as a semiconductor wafer and the chuck supporting the wafer are described. The system includes a heat exchanger used in controlling temperature of a temperature control fluid. A first fluid carrying path carries the temperature control fluid from the heat exchanger to an outlet, the outlet being connectable to the workpiece chuck to carry the temperature control fluid to the workpiece chuck. A second fluid carrying path carries the temperature control fluid from an inlet to the heat exchanger, the inlet being connectable to the workpiece chuck to carry the temperature control fluid from the workpiece chuck to the temperature control system. A dual-flow rate technique is employed such that, when the chuck temperature is in transition, the temperature control fluid is circulated at a relatively high flow rate such that temperature transition of the chuck can be realized at a fast rate. When the temperature of the chuck is being maintained at a set point temperature, the flow rate of the fluid can be reduced such that electrical noise introduced by the motion of the fluid, such as by the triboelectric effect, can be reduced. A capillary tube can be connected between the first fluid carrying path and the second fluid carrying path. First and second valves can be connected in the first and second fluid carrying paths to prevent the flow of fluid into the chuck when the chuck is at high temperature such that motion induced by flash boiling of the fluid is eliminated.

2005021, Oct 6, 2005

Jun 7, 2005

11/146959

Kenneth Cole - Holliston MA, US
William Stone - Lenox MA, US
Douglas Olsen - Natick MA, US

C23C016/00

118724000, 156345270, 156345520, 156345530

A workpiece chuck includes a thermal plate assembly which includes both heating and cooling capability. The heating element can be a resistive heater in a coiled configuration disposed in a plane. The cooling can be performed via a cooling fluid circulated through cooling tubes which are also disposed in a coiled configuration in a plane. The plane of the heating element and the cooling tubes can be the same plane, and that plane can be a center plane of the thermal plate assembly. By locating the heating and cooling in the same plane, uniform heating and cooling are achieved. Also, by locating the heating element and cooling tubes in the center of the thermal plate, distortions such as doming and dishing in the thermal plate are eliminated such that the wafer can be held extremely flat on the chuck. The heating element and cooling tubes are coiled in an interleaved fashion to provide uniform heating and cooling while allowing them to simultaneously occupy the same plane.

6019164, Feb 1, 2000

Jul 14, 1998

9/115206

Paul A. Getchel - Placerville CA
Kenneth M. Cole - Holliston MA
Henry A. Lyden - Wellesley MA
William M. Stone - Lenox MA
Robert Lopez - Boxford MA
Thomas Schey - Woonsocket RI
Dana G. Butcher - Somerville MA

Temptronic Corporation - Newton MA

F28F 700, B25B 1100

165 801

A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects, such that mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated. A plurality of support members including inclined surfaces provided between an upper and lower portion of the chuck maintain the top surface of the chuck and any workpiece mounted thereon at a constant height over temperature.

2002003, Mar 28, 2002

Feb 29, 2000

09/516000

Paul Getchel - Placerville CA, US
Kenneth Cole - Holliston MA, US
Henry Lyden - Wellesley MA, US

F28F007/00

165/080100

A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.

6073681, Jun 13, 2000

Dec 31, 1997

9/001893

Paul A. Getchel - Placerville CA
Kenneth M. Cole - Holliston MA
Henry A. Lyden - Wellesley MA

Temptronic Corporation - Newton MA

F28F 700, B25B 1100

165 801

A workpiece chuck includes an upper assembly on which can be mounted a flat workpiece such as a semiconductor wafer. A lower assembly is mountable to a base that supports the chuck. A non-constraining attachment means such as vacuum, springs or resilient washers applied to the chuck holds the upper assembly to the lower assembly, the lower assembly to the base and can hold the wafer to the top surface of the upper assembly. A heater and a heat sink can be included in the bottom assembly to allow for temperature cycle testing of the wafer. By holding the chuck together by non-constraining means, the chuck layers can move continuously relative to each other under expansion forces caused by temperature effects. Mechanical stresses on the chuck and resulting deformation of the chuck and workpiece over temperature are substantially eliminated.