Inventors:
Michael Estrella - San Jose CA, US
Jae M. Park - San Jose CA, US
Kenneth Robert Thompson - San Jose CA, US
Craig S. Mitchell - San Jose CA, US
Belgacem Haba - Cupertino CA, US
Assignee:
Tessera, Inc. - San Jose CA
International Classification:
H01L 27/00
Abstract:
An image sensor package is disclosed that reduces the overall size of known image sensor packages. The image sensor package includes an image sensor and image sensor controller that are arranged on a substrate so that the surfaces of the image sensor and image sensor controller are directly adjacent one another. A package in accordance with the present invention reduces the amount of space in the package by allowing at least one surface of the image sensor controller and at least one surface of the image sensor to be directly attached or connected to one another. Electrical conductive material in the nature of anisotropic conductive materials is also preferably applied to the substrate in the form of an adhesive layer to allow for the image sensor controller and the image sensor to be in electrical communication with one another.