Inventors:
Brandon Joel Brocklesby - Pflugerville TX, US
Juan Manuel Gonzalez - Round Rock TX, US
Laurent Andrew Regimbal - Round Rock TX, US
Assignee:
DELL PRODUCTS L.P. - Round Rock TX
International Classification:
H05K 7/20
Abstract:
A system and method for mounting a heat sink associated with an electronics component are disclosed. The disclosure provides a method including connecting a CPU support bracket to a board using one or more support bracket connectors, mounting a CPU to the CPU support bracket, and mounting a heat sink assembly to the CPU support bracket using one or more heat sink connectors configured to mate with the one or more support bracket connectors.The disclosure also provides a method for mounting a heat sink assembly associated with a CPU, including removing one or more socket screws installed at one or more corners of a socket disposed in a board, installing one or more support bracket connectors configured to mate with respective holes in the board, and mounting a heat sink assembly to the support bracket connectors using one or more heat sink connectors configured to mate with the one or more support bracket connectors.The disclosure also provides a system for mounting an electronic component and associated heat sink to a board, including a support bracket operable to retain an electronic component and provide at least one electrical connection between a board and the electronic component, a support bracket connector configured to releasably connect the support bracket to the board, and a heat sink connector configured to releasably connect a heat sink with the support bracket connector.