JOSEPH W SOUCY
Broker in Winchester, MA
License number
Massachusetts 62894
Issued Date
May 1, 1985
Expiration Date
Jun 29, 2013
Type
Salesperson
Address
Address
Winchester, MA 01890
Professional information
Sensor Isolation System
US Patent:
7679171, Mar 16, 2010
Filed:
Jun 21, 2005
Appl. No.:
11/157879
Inventors:
Richard S. Anderson - Seabrook NH, US
David S. Hanson - W. Newbury MA, US
Frederick J. Kasparian - W. Roxbury MA, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
David S. Hanson - W. Newbury MA, US
Frederick J. Kasparian - W. Roxbury MA, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Assignee:
The Charles Stark Draper Laboratories, Inc. - Cambridge MA
International Classification:
H01L 23/28
US Classification:
257678, 439330, 257E21502
Abstract:
A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.
Integrated Sensor And Electronics Package
US Patent:
2004000, Jan 15, 2004
Filed:
Feb 26, 2003
Appl. No.:
10/374400
Inventors:
Richard Anderson - Seabrook NH, US
James Connelly - South Weymouth MA, US
David Hanson - West Newbury MA, US
Joseph Soucy - Winchester MA, US
Thomas Marinis - Haverhill MA, US
James Connelly - South Weymouth MA, US
David Hanson - West Newbury MA, US
Joseph Soucy - Winchester MA, US
Thomas Marinis - Haverhill MA, US
International Classification:
H01L027/14
US Classification:
257/414000
Abstract:
An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.
Integrated Sensor And Electronics Package
US Patent:
2005019, Sep 15, 2005
Filed:
Feb 15, 2005
Appl. No.:
11/057872
Inventors:
Richard Anderson - Seabrook NH, US
James Connelly - South Weymouth MA, US
David Hanson - West Newbury MA, US
Joseph Soucy - Winchester MA, US
Thomas Marinis - Haverhill MA, US
James Connelly - South Weymouth MA, US
David Hanson - West Newbury MA, US
Joseph Soucy - Winchester MA, US
Thomas Marinis - Haverhill MA, US
International Classification:
H01L027/14
US Classification:
257414000
Abstract:
An integrated sensor and electronics package wherein a micro-electromechanical sensor die is bonded to one side of the package substrate, one or more electronic chips are bonded to an opposite side of the package substrate, internal electrical connections run from the sensor die, through the package substrate, and to the one or more electronic chips, and input/output connections on the package substrate are electrically connected to one or more of the electronic chips.
Coplanar Mounting Member For A Mem Sensor
US Patent:
2008014, Jun 26, 2008
Filed:
Jun 28, 2007
Appl. No.:
11/823747
Inventors:
David S. Hanson - W. Newbury MA, US
Richard S. Anderson - Seabrook NH, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Richard S. Anderson - Seabrook NH, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
International Classification:
G01P 15/00
US Classification:
7351416
Abstract:
A three axes MEM accelerometer system includes three MEM accelerometer sensors and a MEM sensor board including a MEM sensor control circuit for the accelerometer sensors. The accelerometer sensors are mounted mutually orthogonally. At least two coplanar mounting members have a first surface coplanar with a connection pad on the surface of the sensor board. A second surface is inclined to the surface of the board for mounting a MEM accelerometer sensor. An electrical conductor array interconnects the MEM accelerometer sensor with the connection pad on the board.
Apparatus And System For Suspending A Chip-Scale Device And Related Methods
US Patent:
7215213, May 8, 2007
Filed:
Jul 13, 2005
Appl. No.:
11/181035
Inventors:
Mark J. Mescher - West Newton MA, US
Mathew Varghese - Arlington MA, US
Marc Steven Weinberg - Needham MA, US
Thomas Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Mathew Varghese - Arlington MA, US
Marc Steven Weinberg - Needham MA, US
Thomas Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Assignee:
Charles Stark Draper Laboratory, Inc., The - Cambridge MA
International Classification:
H01S 1/06, H03B 17/00
US Classification:
331 941
Abstract:
A suspension of a chip-scale device is accomplished using a suspension frame and at least one first tether. The chip-scale suspension frame defines a first plane and an opening through the suspension frame. At least one first tether crosses the opening at a first angle relative to the first plane and can be used to position the chip-scale device at least partially within the opening.
Coplanar Mounting Member For A Mem Sensor
US Patent:
7253079, Aug 7, 2007
Filed:
May 9, 2002
Appl. No.:
10/142127
Inventors:
David S. Hanson - Newbury MA, US
Richard S. Anderson - Seabrook NH, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Richard S. Anderson - Seabrook NH, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Assignee:
The Charles Stark Draper Laboratory, Inc. - Cambridge MA
International Classification:
H01I 29/84
US Classification:
438417, 438730, 438676, 257 29324
Abstract:
A coplanar mounting member for a MEM sensor includes a first surface coplanar with a connection pad on the surface of a MEM sensor board containing the MEM sensor control circuit; a second surface inclined to the surface of the board for mounting a MEM sensor and an electrical conductor array for interconnecting the MEM sensor with the connection pad on the board.
Sensor Isolation System
US Patent:
6937479, Aug 30, 2005
Filed:
May 9, 2002
Appl. No.:
10/141993
Inventors:
Richard S. Anderson - Seabrook NH, US
David S. Hanson - W. Newbury MA, US
Frederick J. Kasparian - W. Roxbury MA, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
David S. Hanson - W. Newbury MA, US
Frederick J. Kasparian - W. Roxbury MA, US
Thomas F. Marinis - Haverhill MA, US
Joseph W. Soucy - Winchester MA, US
Assignee:
The Charles Stark Draper Laboratory, Inc. - Cambridge MA
International Classification:
H05K007/02
US Classification:
361769, 257668
Abstract:
A sensor isolation system including a sensor, a package for the sensor, and a compliant interposer disposed between the sensor and the package and interconnecting the sensor to the package to isolate the sensor from thermal and mechanical stresses and yet at the same time providing a physical interconnect between the sensor and the package.