JOSEPH A CICCIO
Broker in Winchester, MA

4225900, Sep 30, 1980

Oct 25, 1978

5/954513

Joseph A. Ciccio - Winchester MA
Rudolf E. Thun - Carlisle MA
Harry J. Fardy - Chelmsford MA

Raytheon Company - Lexington MA

H05K 108

361395

An integrated circuit device package is disclosed wherein a pair of dielectric support structures are provided, each one having a pattern of electrical conductors for interconnecting integrated circuit devices disposed thereon. The electrical conductors have end portions terminating into a plurality of contact pads disposed on a first surface of the support structures. A first one of the pair of support structures has corresponding contact pads on a second, opposite surface of the support structure, each one of the contact pads on the first surface being electrically connected to a corresponding one of the contact pads on the second surface. A dielectric spacer having a plurality of electrical contact pins is disposed between the pair of support structures. One end of each pin is electrically connected to a corresponding one of the contact pads disposed on the second surface of the first one of such structures, and the other end of such contact pin is electrically connected to a corresponding one of the contact pins disposed on the first surface of the second one of the structures. The contact pins are relatively short and thereby provide a relatively short electrical interconnect for the integrated circuit devices, thereby reducing parasitic capacitances normally associated with electrical interconnects.