JOSE A DIAZ
Physician Assistant at 152 Ave, Hollywood, FL

6813154, Nov 2, 2004

Dec 10, 2002

10/315702

Jose Diaz - Pembroke Pines FL
Harold M. Cook - Boynton Beach FL
Edmund B. Boucher - Fort Lauderdale FL

Motorola, Inc. - Schaumburg IL

H05K 720

361704, 165 802, 165 803, 165185, 174 163, 174 522, 257707, 257713, 257678, 257690, 257698, 361707, 361717, 361718, 361722, 361761, 361764, 361768, 361774, 361777

A reversible heat sink packaging assembly ( ) for integrated circuits is provided. The packaging assembly ( ) includes a chip carrier ( ) having an opening ( ) formed therein and a heat sink ( ). The heat sink ( ) is attached to one side of a die ( ). The die ( ) fits into the opening ( ) of the carrier ( ) with the heat sink ( ) abutting one side ( ) of the carrier and the die being wire bonded ( ) to the other side ( ) of the carrier. The packaging assembly ( ) can be oriented either device side up or down.

6784366, Aug 31, 2004

Jun 10, 2003

10/457914

Edmund B. Boucher - Boca Raton FL
Harold M. Cook - Boynton Beach FL
Jose N. Diaz - Pembroke Pines FL

Motorola, Inc. - Schaumburg IL

H05K 506

174 522, 257575, 257713, 361719

An electronic component ( ), such as a power transistor, is formed of a molded plastic package having top ( ), bottom ( ) and side ( ) surfaces and electrical contacts. A lead frame ( ) attaches to one of the contacts and wraps about the component ( ) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.

2007004, Mar 1, 2007

Aug 25, 2005

11/213196

Jose Diaz - Pembroke Pines FL, US

H05K 7/20

361719000

An assembly () is provided which allows high power packaged power components () to operate at optimum power levels without degradation in performance. The assembly includes a heat sink (), a printed circuit board (pcb) isolator () and a contact ring (). The pcb isolator () provides electrical contacts () upon which to mount the component and includes an opening () through which the component is soldered to the heat sink (). The contact ring () is mounted to the pcb isolator () to form a cavity () within which the component () is contained. The assembly () can be coupled into a product having a chassis () and a product circuit board () such that the contact ring () is soldered to the product circuit board for electrical connection, and the heat sink is thermally coupled to the product chassis for heat dissipation.

7104830, Sep 12, 2006

Aug 12, 2005

11/201953

Jose Diaz - Hollywood FL, US

H01R 13/62

439372, 439347

An electrical connection that is equipped with a pullout prevention clip which can be advantageously used to prevent an electrical plug from being accidentally removed from the connection. The electrical connection includes a socket member formed recessed in an electronic device for receiving a plug, the plug is molded with a groove in an outer peripheral surface, a shaft member attached to the electronic device for anchoring a clip member and acting as an axis pivotally or slidingly engages the clip member, the clip member has a cutout portion for engaging the groove in the plug upon deployment and thereby preventing the plug from being accidentally or unintentionally pulled out.

2008007, Apr 3, 2008

Sep 28, 2006

11/536570

Edmund B. Boucher - Davie FL, US
George C. Anderson - Sunrise FL, US
Jose N. Diaz - Pembroke Pines FL, US

MOTOROLA, INC. - Plantation FL

H01L 23/34

257706

A miniature multiple die packaging assembly suitable for use in a radio is provided. The assembly includes a heatsink having contact with a chassis of the radio, a circuit board containing a plurality of active devices having leads to a perimeter of the circuit board, and a mating board having an opening. The mating board attaches along a top perimeter of the circuit board to pass the leads of the circuit board for extending a connection of the active devices to a radio board. The plurality of active devices are in contact and coplanar with the heatsink for providing efficient heat dissipation. The circuit board can interchangeably accept single package die or multiple package die having different sizes and layouts.

7259446, Aug 21, 2007

Aug 25, 2005

11/213200

Jose Diaz - Pembroke Pines FL, US
George C. Anderson - Sunrise FL, US

Motorola, Inc. - Schaumburg IL

H01L 23/495

257675, 257706, 257E33075

A packaging assembly () includes a plurality of dissimilar die () bonded to a base board () and ground coupled to a heat sink () through an opening (). A mating board () is coupled to the base board () to provide separate surface mountable contacts (-) with which to independently bias each die () while the heat sink () provides thermal dissipation for the die. Assembly () provides a surface mountable package well suited to multiband applications.