JON WILLIAM HEYL
Pilots at Crystal Crk Blvd, Orlando, FL
License number
Florida A0837947
Issued Date
Dec 2016
Expiration Date
Jun 2017
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
3116 Crystal Creek Blvd, Orlando, FL 32837
Professional information
Vice President Of Business Development - Oled Technologies
Position:
Vice President of Business Development at Oled Technologies B.V., Captain Rated 1st Officer at Miami Air International
Location:
Orlando, Florida Area
Industry:
Semiconductors
Work:
Oled Technologies B.V.
since Apr 2010
-
Vice President of Business Development
Miami Air International
since Dec 2007
-
Captain Rated 1st Officer
Controlled Semiconductor
Nov 2003 - Dec 2008
-
Management /Sales
Sonoscan
Jan 2000 - Oct 2003
-
Sales Management
Reis Robotics
Aug 1996 - Dec 1999
-
Management
PCAutomation Systems, Inc.
May 1985 - Aug 1996
-
Management
Interests:
TaeKwonDo, TungSoDo, Music, Boating and Flying
Honor & Awards:
Airline Transport Pilot
Lead Frame Isolation Using Laser Technology
US Patent:
8198137, Jun 12, 2012
Filed:
Jun 30, 2006
Appl. No.:
12/084444
Inventors:
Jon Heyl - Orlando FL, US
International Classification:
H01L 35/34
US Classification:
438111
Abstract:
Systems and methods for electrically isolating conductive members on an array of lead frames. In one embodiment, a system includes a stage for positioning the array to receive laser radiation, a computer system and electro-optical components. The system can sever conductive members from one another by laser ablation effected with programmable scanning of light from a laser. Software effects ablation paths along a plurality of lines across the array of lead frames. In a related method, the array is of a specified design and of the type formed on a sheet having a plurality lead frames interconnected through integrally formed dam bars. Reference information is provided to describe geometric or dimensional features, including predefined laser ablation scan paths for performing cuts along predefined cut lines on each lead frame. The cut lines are specific to the lead frame array design. Fiducial markings are located on the sheet.
Semiconductor Failure Analysis Tool
US Patent:
7705267, Apr 27, 2010
Filed:
Jun 30, 2006
Appl. No.:
11/480299
Inventors:
Jon Heyl - Orlando FL, US
International Classification:
B23K 26/38
US Classification:
21912168, 21912169, 378 62, 438 4
Abstract:
Systems and methods for removing material from a packaged electronic device of the type encapsulated with a protective material that forms an outer surface of the device. An exemplary system includes a stage for placing the device in a first position for receiving laser radiation to remove the material by ablation, and for placing the device in a second position for viewing one or more features along the outer surface of the device. An optical system is configured to provide an exterior image, including one or more features along an exposed surface of the device, while the device remains in the second position. A viewing system displays a captured image of the device, including one or more features interior to the protective surface, overlayed with the exterior image for simultaneous viewing of both images so that a position of a first feature present in the captured image can be viewed in relation to a position of a second feature in the exterior image. The combination of the first feature position and the second feature position can be used to define a region of the device for material removal with a laser. In an associated method a captured image of the device is provided, the image including one or more features interior to the protective surface.