Inventors:
Weifeng Liu - Roseville CA, US
John J. Lewis - Sacramento CA, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H01L 23/48, H01L 21/44, B23K 31/02
US Classification:
257738, 257772, 257779, 257781, 257E23021, 257E23033, 257E23069, 438613, 22818022
Abstract:
An electronic device comprises a device substrate, a plurality of compliant electrically-conductive balls, and a plurality of solder joints that couple the compliant electrically-conductive balls to the device substrate by a reflow process.