JOHN W BOWEN
Nursing in Warminster, PA
License number
Pennsylvania RN595466
Category
Nursing
Type
Registered Nurse
Address
Address
Warminster, PA 18974
Personal information
See more information about JOHN W BOWEN at radaris.comName
Address
Phone
506 Ward Rd, Brookhaven, PA 19015
5211 Ridge Ave #3, Philadelphia, PA 19128
462 Blossom Dr, Pittsburgh, PA 15236
49 N Maysville Rd, Greenville, PA 16125
590 W 8Th St, Wyoming, PA 18644
Professional information
Methods And Apparatus For Wire Bonding With Wire Length Adjustment In An Integrated Circuit
US Patent:
7443042, Oct 28, 2008
Filed:
Mar 21, 2006
Appl. No.:
11/385245
Inventors:
Timothy Brooks Bambridge - Pittstown NJ, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 23/48, H01L 23/52
US Classification:
257784, 257723, 257724
Abstract:
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
Self Alignment Device For Ball Grid Array Devices
US Patent:
6313999, Nov 6, 2001
Filed:
Jun 10, 1999
Appl. No.:
9/329420
Inventors:
Roger Anthony Fratti - Shillington PA
John Wayne Bowen - Warminster PA
Dwight David Daugherty - Ephrata PA
Xiaohong Jiang - New Providence NJ
John Wayne Bowen - Warminster PA
Dwight David Daugherty - Ephrata PA
Xiaohong Jiang - New Providence NJ
Assignee:
Agere Systems Optoelectronics Guardian Corp. - Orlando FL
International Classification:
H01R 1232, H01R 1236
US Classification:
361774
Abstract:
An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.
Efficient Power Amplifier
US Patent:
6329877, Dec 11, 2001
Filed:
Jun 25, 1999
Appl. No.:
9/344756
Inventors:
John Wayne Bowen - Warminster PA
Roger Anthony Fratti - Cumru Township, Berks County PA
James Daniel Yoder - Leola PA
Roger Anthony Fratti - Cumru Township, Berks County PA
James Daniel Yoder - Leola PA
Assignee:
Agere Systems Guardian Corp. - Orlando FL
International Classification:
H03F 368, H03F 360, H03F 304
US Classification:
330124R
Abstract:
There is disclosed a power amplifier includes an in-phase power splitter generating two split signals from an input signal, and two amplifiers capable of operating in different modes. The split signals are provided as respective inputs to the two amplifiers which are coupled through transmission lines such that as the first amplifier approaches the maximum power it can produce, the output from the second amplifier begins to contribute to the power amplifier output and supplements and modifies the power provided by the first amplifier thereby extending the range of input power over which the power amplifier delivers output power.
Methods And Apparatus For Wire Bonding With Wire Length Adjustment In An Integrated Circuit
US Patent:
7086148, Aug 8, 2006
Filed:
Feb 25, 2004
Appl. No.:
10/787010
Inventors:
Timothy Brooks Bambridge - Pittstown NJ, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H05K 3/00
US Classification:
29843, 29842, 29850, 228 45, 228179, 2281805
Abstract:
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.
Wideband Balun For Wireless And Rf Application
US Patent:
6140886, Oct 31, 2000
Filed:
Feb 25, 1999
Appl. No.:
9/257014
Inventors:
Roger Anthony Fratti - Shillington PA
John Wayne Bowen - Warminster PA
Melvin West - Willingboro NJ
John Wayne Bowen - Warminster PA
Melvin West - Willingboro NJ
Assignee:
Lucent Technologies, Inc. - Murray Hill NJ
International Classification:
H01P 510
US Classification:
333 26
Abstract:
A transmission line balun transformer for providing a single ended output signal from a pair of differential input signals includes two transmission line signal couplers. The couplers are individually designed to be relatively loosely coupled devices, i. e. having a coupling factor greater than 3 dB, but are coupled together with proper phase relationships so as to achieve a relatively tighter composite coupling characteristic in the order of 3 dB, thereby resulting in an increase in bandwidth.
Methods And Apparatus For Wire Bonding With Wire Length Adjustment In An Integrated Circuit
US Patent:
7637414, Dec 29, 2009
Filed:
Jul 11, 2008
Appl. No.:
12/171903
Inventors:
Timothy Brooks Bambridge - Pittstown NJ, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
B23K 31/00
US Classification:
2281805, 228 45, 228103
Abstract:
An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.