JOHN W BOWEN
Nursing in Warminster, PA

7443042, Oct 28, 2008

Mar 21, 2006

11/385245

Timothy Brooks Bambridge - Pittstown NJ, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US

Agere Systems Inc. - Allentown PA

H01L 23/48, H01L 23/52

257784, 257723, 257724

An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

6313999, Nov 6, 2001

Jun 10, 1999

9/329420

Roger Anthony Fratti - Shillington PA
John Wayne Bowen - Warminster PA
Dwight David Daugherty - Ephrata PA
Xiaohong Jiang - New Providence NJ

Agere Systems Optoelectronics Guardian Corp. - Orlando FL

H01R 1232, H01R 1236

361774

An apparatus which aligns a ball grid array (BGA) device over a substrate. The apparatus preferably includes a cup-shaped member for cupping and holding the solder balls of the BGA device, and an elongate member attached to the cup-shaped member. The cup-shaped member is attached between the BGA device and the substrate at two or more different positions so that the solder balls of the BGA device become aligned over the terminals of the substrate by operation of gravity.

6329877, Dec 11, 2001

Jun 25, 1999

9/344756

John Wayne Bowen - Warminster PA
Roger Anthony Fratti - Cumru Township, Berks County PA
James Daniel Yoder - Leola PA

Agere Systems Guardian Corp. - Orlando FL

H03F 368, H03F 360, H03F 304

330124R

There is disclosed a power amplifier includes an in-phase power splitter generating two split signals from an input signal, and two amplifiers capable of operating in different modes. The split signals are provided as respective inputs to the two amplifiers which are coupled through transmission lines such that as the first amplifier approaches the maximum power it can produce, the output from the second amplifier begins to contribute to the power amplifier output and supplements and modifies the power provided by the first amplifier thereby extending the range of input power over which the power amplifier delivers output power.

7086148, Aug 8, 2006

Feb 25, 2004

10/787010

Timothy Brooks Bambridge - Pittstown NJ, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US

Agere Systems Inc. - Allentown PA

H05K 3/00

29843, 29842, 29850, 228 45, 228179, 2281805

An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.

6140886, Oct 31, 2000

Feb 25, 1999

9/257014

Roger Anthony Fratti - Shillington PA
John Wayne Bowen - Warminster PA
Melvin West - Willingboro NJ

Lucent Technologies, Inc. - Murray Hill NJ

H01P 510

333 26

A transmission line balun transformer for providing a single ended output signal from a pair of differential input signals includes two transmission line signal couplers. The couplers are individually designed to be relatively loosely coupled devices, i. e. having a coupling factor greater than 3 dB, but are coupled together with proper phase relationships so as to achieve a relatively tighter composite coupling characteristic in the order of 3 dB, thereby resulting in an increase in bandwidth.

7637414, Dec 29, 2009

Jul 11, 2008

12/171903

Timothy Brooks Bambridge - Pittstown NJ, US
John Wayne Bowen - Warminster PA, US
John McKenna Brennan - Wyomissing PA, US
Joseph Michael Freund - Fogelsville PA, US

Agere Systems Inc. - Allentown PA

B23K 31/00

2281805, 228 45, 228103

An integrated circuit is wire bonded in a manner such that there is consistent RF performance from integrated circuit package to integrated circuit package. Bond distances within the integrated circuit are measured, each corresponding to a wire bond to be formed. An area under a hypothetical wire bond profile is calculated as a function of the bond distances, a baseline wire length, and a baseline loop height. A wire is bonded across a given one of the bond distances to form a given one of the wire bonds. A wire bond profile for the given wire bond is provided having an area thereunder that is substantially equal to the calculated area.