John Spano
Pharmacy at Jasper Dr, Colorado Springs, CO
License number
Colorado 1322
Issued Date
Mar 26, 1987
Renew Date
Feb 28, 1991
Expiration Date
Feb 28, 1991
Type
Residential Wireman
Address
Address
2
109 Jasper Dr, Colorado Springs, CO 80911
Colorado Springs, CO
Colorado Springs, CO
Professional information
Passivation Method And Structure Using Hard Ceramic Materials Or The Like
US Patent:
5578867, Nov 26, 1996
Filed:
Feb 27, 1995
Appl. No.:
8/394467
Inventors:
George Argos - Colorado Springs CO
John D. Spano - Colorado Springs CO
Steven D. Traynor - Colorado Springs CO
John D. Spano - Colorado Springs CO
Steven D. Traynor - Colorado Springs CO
Assignee:
Ramtron International Corporation - Colorado Springs CO
International Classification:
H01L 2976, H01L 3100
US Classification:
257632
Abstract:
A method for passivating an integrated circuit includes the RF sputtering of a hard passivation layer on the surface of the integrated circuit. The hard passivation layer can be a ceramic material such as various doped and undoped titanates, zirconates, niobates, tantalates, stanates, hafnates, and manganates, in either their ferroelectric or non-ferroelectric phases. Other exotic, hard, and usually non-ferroelectric materials not normally found in integrated circuit processing such as carbides may also be used. If the integrated circuit sought to be passivated contains ferroelectric devices, the hard passivation layer can be fabricated out of the same material used in the integrated ferroelectric devices. An optional silicon dioxide insulating layer can be deposited on the surface of the integrated circuit before the hard passivation layer is deposited. The optional silicon dioxide layer is used to prevent any possible contamination of the integrated circuit by the passivation layer.
Passivation Method And Structure For A Ferroelectric Integrated Circuit Using Hard Ceramic Materials Or The Like
US Patent:
5438023, Aug 1, 1995
Filed:
Mar 11, 1994
Appl. No.:
8/212495
Inventors:
George Argos - Colorado Springs CO
John D. Spano - Colorado Springs CO
Steven D. Traynor - Colorado Springs CO
John D. Spano - Colorado Springs CO
Steven D. Traynor - Colorado Springs CO
Assignee:
Ramtron International Corporation - Colorado Springs CO
International Classification:
H01L 2102
US Classification:
437235
Abstract:
A method for passivating an integrated circuit includes the RF sputtering of a hard passivation layer on the surface of the integrated circuit. The hard passivation layer can be a ceramic material such as various doped and undoped titanates, zirconates, niobates, tantalates, stanates, hafnates, and manganates, in either their ferroelectric or non-ferroelectric phases. Other exotic, hard, and usually non-ferroelectric materials not normally found in integrated circuit processing such as carbides may also be used. If the integrated circuit sought to be passivated contains ferroelectric devices, the hard passivation layer can be fabricated out of the same material used in the integrated ferroelectric devices. An optional silicon dioxide insulating layer can be deposited on the surface of the integrated circuit before the hard passivation layer is deposited. The optional silicon dioxide layer is used to prevent any possible contamination of the integrated circuit by the passivation layer.