JOHN ROBERT PIERCE
Cosmetology at Bentwood Trl, Dallas, TX

License number

Texas 1724599

Expiration Date

Jan 12, 2019

Personal information

See more information about JOHN ROBERT PIERCE at radaris.com

Name

Address

Phone

John Pierce

5125 Lake Crest Dr, Mc Kinney, TX 75071

(972) 562-8840

John Pierce, age 57

5123 Happiness St, San Antonio, TX 78219

(210) 381-8552

John Pierce, age 86

509 Mccracken Dr, Graham, TX 76450

John Pierce, age 73

508 Blyth Rd, Victoria, TX 77904

(361) 652-8793

John Pierce, age 68

5318 Lookout Mountain Dr, Houston, TX 77069

(713) 410-5200

Professional information

Senior Systems Engineer At The Home Depot

Position:

Senior Systems Engineer at The Home Depot

Location:

Dallas/Fort Worth Area

Industry:

Retail

Work:

The Home Depot since Jun 2010 - Senior Systems Engineer McKesson Provider Technologies Feb 2007 - Sep 2009 - Technical Implementation Engineer McKesson Provider Technologies Feb 2004 - Feb 2007 - Senior DBA, Instructor University of Colorado at Colorado Springs 2003 - 2003 - Full-time graduate student Agilent Technologies 1999 - 2003 - Member of IT Consulting Staff Hewlett-Packard (HP) 1996 - 1999 - Information Technology Engineer Consultant Hewlett-Packard 1990 - 1996 - IT Engineer Consultant Hewlett-Packard 1984 - 1990 - Sr. Response Center Engineer

Education:

University of Colorado Colorado Springs 2003 - 2003
New Mexico State University
Bachelor's, Electrical and Computer Engineering

President At Protex Solutions, Llc

Position:

President at Protex Solutions, LLC, President/G.M. at Protech Roofing, LLC

Location:

Dallas/Fort Worth Area

Industry:

Construction

Work:

Protex Solutions, LLC since Dec 2012 - President Protech Roofing, LLC - DFW Houston Austin since Apr 2006 - President/G.M. TD Supply Apr 1999 - Jun 2006 - Co-Founder

Education:

University of North Texas 1982 - 1985
Bachelor of Business Administration (B.B.A.), Accounting and Finance University of North Texas 1982 - 1985
BBA, Finance/Acctg.

Honor & Awards:

Award winning trumpet player @HSPVA

Certifications:

TPO Certified Contractor, GenFlex Commercial Roofing Co.
Roofing Contractor License, City of Dallas, TX

Owner At Pierce Electical Services Llc

Position:

Owner at PIERCE ELECTRICAL SERVICE, Owner at PIERCE ELECTICAL SERVICES LLC

Location:

Dallas/Fort Worth Area

Industry:

Construction

Work:

PIERCE ELECTRICAL SERVICE - Owner PIERCE ELECTICAL SERVICES LLC - Carrollton, TX since Jan 1992 - Owner

Education:

DeVry University-Texas
The University of Texas at Arlington

Owner Of Pierce Family Farms

Position:

Owner at Pierce Family Farms

Location:

Dallas/Fort Worth Area

Industry:

Farming

Work:

Pierce Family Farms - Owner

Education:

Louisiana State University 1961 - 1964
Bachelor of Science, Agriculture- Animal Science

Owner, Quality Audio Visual Service, Inc.

Position:

Owner at Quality Audio Visual Service, Inc.

Location:

Dallas/Fort Worth Area

Industry:

Retail

Work:

Quality Audio Visual Service, Inc. - Owner

Method For Constructing A Wafer Interposer By Using Conductive Columns

US Patent:

6440771, Aug 27, 2002

Filed:

Mar 23, 2001

Appl. No.:

09/816516

Inventors:

John L. Pierce - Dallas TX

Assignee:

Eaglestone Partners I, LLC - Long Beach CA

International Classification:

H01L 2150

US Classification:

438106, 438118, 438612

Abstract:

The present invention provides a method and apparatus for testing wafers that is simple and allows testing prior to dicing so that the need to temporarily package individual dies for testing is eliminated. As a result, the number of manufacturing steps is reduced, thus increasing first pass yields. In addition, manufacturing time is decreased, thereby improving cycle times and avoiding additional costs. The invention also provides for packaging of the die at the completion of testing. One form of the present invention provides an interposer substrate connected to a wafer through conductive columns.

Method For Forming Conductive Bumps For The Purpose Of Contrructing A Fine Pitch Test Device

US Patent:

2002001, Jan 31, 2002

Filed:

Nov 17, 1998

Appl. No.:

09/193830

Inventors:

KENNETH R. SMITH - PLANO TX, US
JOHN L. PIERCE - DALLAS TX, US

International Classification:

G01R031/02

US Classification:

324/755000

Abstract:

A system is described for using with fine pitch devices including singulated bare die, semiconductor wafers, chip sized packages, printed circuit boards, and the like to determine that the fine pitch device is not faulty. The system is also usable for transfer of data, energy, for collecting data measurements or measurement-related data between two pieces, and for effecting at least part of an identification process. The disclosed embodiment includes a substrate having a circuit pad pattern in the mirror image of the pattern of contact points, usually bond pads of the fine pitch device to be connected. A conductive elastomeric probe is permanently formed on the circuit pads of the substrate such that the probe is malleable and allows repetitive electrical contact. The system may also contain an alignment template for orienting the fine pitch device onto the elastomeric probes of the contact point pattern of the substrate.

Wafer Interposer Assembly

US Patent:

6933617, Aug 23, 2005

Filed:

Feb 24, 2003

Appl. No.:

10/373413

Inventors:

John L. Pierce - Dallas TX, US

Assignee:

Eaglestone Partners I, LLC - Long Beach CA

International Classification:

H01L023/48

US Classification:

257786, 257673, 257701, 257734, 257778

Abstract:

A wafer interposer assembly and a system for building the same are disclosed. The wafer interposer assembly includes a semiconductor wafer () having a die () and a redistribution layer pad () electrically connected to the die (). An epoxy layer () is deposited on the surface of the redistribution layer pad () and the die (). An interposer pad () is positioned in an opening () in the epoxy layer () in electrical contact with the redistribution layer pad ().