JOHN R MARTIN
Engineering in Foxborough, MA
License number
Massachusetts 26202
Issued Date
Mar 24, 1972
Expiration Date
Jun 30, 2018
Type
Chemical Engineer
Address
Address
Foxborough, MA 02035
Professional information
Process For Wafer Level Treatment To Reduce Stiction And Passivate Micromachined Surfaces And Compounds Used Therefor
US Patent:
6674140, Jan 6, 2004
Filed:
Jan 29, 2001
Appl. No.:
09/771872
Inventors:
John R. Martin - Foxborough MA
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 2984
US Classification:
257415, 257642
Abstract:
This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i. e. , before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
In-Situ Cap And Method Of Fabricating Same For An Integrated Circuit Device
US Patent:
6734550, May 11, 2004
Filed:
Oct 15, 2002
Appl. No.:
10/270872
Inventors:
John R. Martin - Foxborough MA
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 2312
US Classification:
257704, 257687, 257417, 257659, 257678, 438125, 438106, 438127, 438121, 438123, 438124, 438 52, 438 53
Abstract:
An in-situ cap for an integrated circuit device such as a micromachined device and a method of making such a cap by fabricating an integrated circuit element on a substrate; forming a support layer over the integrated circuit element and forming a cap structure in the support layer covering the integrated circuit element.
Low Oxygen Assembly Of Glass Sealed Packages
US Patent:
6358771, Mar 19, 2002
Filed:
Jul 2, 1998
Appl. No.:
09/109434
Inventors:
John R. Martin - Foxborough MA
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 2144
US Classification:
438106, 438115, 438117
Abstract:
A micromachined accelerometer is hermetically sealed in a reduced oxygen environment to allow organics to survive high temperature sealing processes.
Pressure Sensing Device Having Fill Fluid Contamination Detector
US Patent:
5072190, Dec 10, 1991
Filed:
Aug 14, 1990
Appl. No.:
7/567411
Inventors:
John R. Martin - Foxboro MA
Assignee:
The Foxboro Company - Foxboro MA
International Classification:
G01R 2722, G01R 2726
US Classification:
324663
Abstract:
A monitoring system for testing the integrity of seal structures, filled with an electrically non-conductive fluid and for validating measurements of a measurement device. The monitoring system includes electrodes disposed in the fluid for measuring an electrical property of the fluid. The system indicates when the measured electrical property changes, which indicates contamination of the fluid.
Static Dissipation Treatments For Optical Package Windows
US Patent:
7338705, Mar 4, 2008
Filed:
Mar 20, 2006
Appl. No.:
11/384719
Inventors:
John R. Martin - Foxborough MA, US
Maurice Karpman - Brookline MA, US
Lawrence E. Felton - Hopkinton MA, US
Maurice Karpman - Brookline MA, US
Lawrence E. Felton - Hopkinton MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
B32B 15/08, B32B 27/00, B32B 27/18, B32B 27/30, G02B 26/00
US Classification:
428323, 428422, 428457, 428500, 428522, 345 31, 359224, 359225, 359291, 359295, 977750, 977753
Abstract:
An optically transparent conductive material is disposed directly or indirectly on an inside surface of a cover material for static dissipation in an optical switching device. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection. An additional coating may be disposed directly or indirectly on an outside surface of the cover material.
Method Of Substrate Bonding With Bonding Material Having Rare Earth Metal
US Patent:
8293582, Oct 23, 2012
Filed:
Jun 15, 2011
Appl. No.:
13/161108
Inventors:
John R. Martin - Foxborough MA, US
Christine H. Tsau - Arlington MA, US
Timothy J. Frey - Hudson MA, US
Christine H. Tsau - Arlington MA, US
Timothy J. Frey - Hudson MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 21/44, H01L 21/48, H01L 21/50
US Classification:
438113, 438455, 257E21499
Abstract:
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
Mems Device With Non-Standard Profile
US Patent:
7521363, Apr 21, 2009
Filed:
Aug 9, 2004
Appl. No.:
10/914575
Inventors:
John R. Martin - Foxborough MA, US
Lawrence E. Felton - Hopkinton MA, US
Lawrence E. Felton - Hopkinton MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 29/84
US Classification:
438691, 438 51, 438113, 438459, 438703, 257E21499, 257E31117, 257E31127
Abstract:
A method of producing a MEMS device forms structure on a non-standard device wafer. To that end, the method provides the noted non-standard device wafer, which has a wafer outer diameter and a non-standard thickness. As known by those in the art, a standard device wafer has a standard thickness when its outer diameter equals the wafer outer diameter. In illustrative embodiments, however, the non-standard thickness is smaller than the standard thickness. The method then forms structure on the non-standard device wafer.
Static Dissipation Treatments For Optical Package Windows
US Patent:
7033672, Apr 25, 2006
Filed:
Mar 19, 2002
Appl. No.:
10/101016
Inventors:
John R. Martin - Foxborough MA, US
Maurice Karpman - Brookline MA, US
Lawrence E. Felton - Hopkinton MA, US
Maurice Karpman - Brookline MA, US
Lawrence E. Felton - Hopkinton MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
B32B 27/18, B32B 27/30, B32B 33/00, G02B 26/00
US Classification:
428422, 428457, 428500, 359224, 359225, 359291, 359295, 345 31
Abstract:
An optically transparent conductive material is used for static dissipation of a cover material for an optical switching device. The optically transparent conductive material is deposited directly or indirectly on the cover material. The optically transparent conductive material forms an electrically continuous film. The optically transparent conductive material can also be used for anti-reflection.
Fiber-Attached Optical Devices With In-Plane Micromachined Mirrors
US Patent:
6931170, Aug 16, 2005
Filed:
Oct 18, 2002
Appl. No.:
10/274496
Inventors:
Chang-Han Yun - Boston MA, US
Shanti Bhattacharya - Chennai, IN
Yakov Reznichenko - Newton MA, US
John R. Martin - Foxborough MA, US
Lawrence E. Felton - Hopkinton MA, US
Jeffrey Swift - Andover MA, US
Kieran P. Harney - Andover MA, US
Michael W. Judy - Wakefield MA, US
Shanti Bhattacharya - Chennai, IN
Yakov Reznichenko - Newton MA, US
John R. Martin - Foxborough MA, US
Lawrence E. Felton - Hopkinton MA, US
Jeffrey Swift - Andover MA, US
Kieran P. Harney - Andover MA, US
Michael W. Judy - Wakefield MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
G02B006/26, G02B006/42
US Classification:
385 18, 385 47
Abstract:
A fiber-attached optical device with in-plane micromachined mirrors includes a cover having at least one reflector formed on one side and a substrate having a plurality of micromachined optical mirrors formed substantially on a single plane on a side facing toward the mirrored side of the cover. The micromachined optical mirrors are controllable to reflect optical signals between a plurality of optical fiber segments via the at least one reflector. The plurality of optical fiber segments can be attached to either the cover or the substrate so as to form an integrated package including the substrate, the cover, and the plurality of optical fiber segments. The mirrors can be controlled to variably attenuate the optical signals.
Substrate Bonding With Bonding Material Having Rare Earth Metal
US Patent:
7981765, Jul 19, 2011
Filed:
May 4, 2009
Appl. No.:
12/434886
Inventors:
John R. Martin - Foxborough MA, US
Christine H. Tsau - Arlington MA, US
Timothy J. Frey - Hudson MA, US
Christine H. Tsau - Arlington MA, US
Timothy J. Frey - Hudson MA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H01L 21/30, H01L 21/46
US Classification:
438455, 438107, 438113, 257E21499, 257E21599
Abstract:
A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.