JOHN MILTON MCCORMICK
Pilots at Boston St, Chandler, AZ
License number
Arizona A2293760
Issued Date
Apr 2015
Expiration Date
Apr 2017
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
149 W Boston St, Chandler, AZ 85225
Professional information
System For Processing And Presenting Cost Estimates In The Construction Industry
US Patent:
5893082, Apr 6, 1999
Filed:
Dec 23, 1996
Appl. No.:
8/771669
Inventors:
John M. McCormick - Chandler AZ
International Classification:
G06F 1750
US Classification:
705400
Abstract:
A computer system for processing and presenting cost estimates in the construction industry includes a CPU; primary input hardware for entering data and commands to the CPU; output hardware including a display for displaying information; estimating hardware for interacting with a plan print to count and/or scale off measurements of assemblies and/or items on the plan print and input such counts and/or measurements into the CPU for processing; and a memory unit having a stored assembly information record list database and a stored item information record list database and including software means for permitting an operator to command, through the primary input hardware, an opening for concurrent use of any selected number of takeoff windows from the assembly and/or item information record lists; a closing of any open takeoff window; an opening of any additional takeoff window; and a count and/or scaling off of measurements of assemblies and/or items from a plan print with the estimating hardware for cost estimating purposes.
Fine Pitch Copper Pillar Package And Method
US Patent:
8536458, Sep 17, 2013
Filed:
Mar 30, 2009
Appl. No.:
12/414220
Inventors:
Robert Francis Darveaux - Gilbert AZ, US
David McCann - Chandler AZ, US
John McCormick - Chandler AZ, US
Louis W. Nicholls - Gilbert AZ, US
David McCann - Chandler AZ, US
John McCormick - Chandler AZ, US
Louis W. Nicholls - Gilbert AZ, US
Assignee:
Amkor Technology, Inc. - Chandler AZ
International Classification:
H05K 1/03, H05K 1/11
US Classification:
174255, 174267
Abstract:
An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.