JOHN M BARRON
Nursing at 29 Ct, Hollywood, FL

6928726, Aug 16, 2005

Jul 24, 2003

10/626058

James A. Zollo - Weston FL, US
John K. Arledge - Ft. Lauderdale FL, US
John C. Barron - Davie FL, US
Gary R. Burhance - Boynton Beach FL, US
John Holley - Dacula GA, US
Henry F. Liebman - Tamarac FL, US

Motorola, Inc. - Schaumburg IL

H05K003/30, H05K001/16

29832, 29825, 29830, 29852, 174260, 174262, 361330, 361760

A substrate assembly () and method of making same has at least one embedded component () in a via () of a substrate core () and includes a first adhesive layer () coupled to the substrate core, and a second adhesive layer () on at least portions of a top surface of the substrate core and above portions of the embedded component. The substrate assembly can further include a first conductive layer () adhered to the bottom surface of the substrate core and a second conductive layer () on the second adhesive layer. The substrate assembly can further include an interconnection () between a conductive surface of the embedded component and at least one among the first conductive layer and the second conductive layer. The interconnection can be formed through an opening () that at least temporarily exposes at least a conductive surface () of the embedded component.

5771154, Jun 23, 1998

Apr 3, 1997

8/833018

Mitchell E. Goodman - Coral Springs FL
John C. Barron - Davie FL
Robert B. Ford - Tamarac FL

Motorola, Inc. - Schaumburg IL

H05H 720

361704

A heatsink assembly (100) provides additional heat dissipation for a high-power integrated circuit package (102) contained within a communication product housing (130). There is an integral heatsink (104) protruding from the package. The heatsink frictionally mates with the first end (108) of a thermally conductive member (106). The second end (110) of the conductive member is magnetically-coupled to the rear surface (123) of a loudspeaker magnet (122). Tabs (111) extending away from the second end of the conductive member provide added mechanical support, preventing the second end from sliding against the rear surface of the magnet. Heat generated by the high-power device is transferred from the package heatsink, via the thermally conductive member, to the loudspeaker magnet such that heat is dissipated away from the package and toward the magnet.

7375979, May 20, 2008

Mar 25, 2005

11/089986

Gary R. Burhance - Boynton Beach FL, US
John C. Barron - Davie FL, US
Peter J. Bartels - Sunrise FL, US

Motorola, Inc. - Schaumburg IL

H05K 1/11

361801, 361759, 361802, 361756

A differential pair () is provided by routing a printed circuit board () having high density interconnect (HDI) substrate () with first and second metal layers () such that a first runner () forms a zigzag pattern using the two metal layers while a second runner () forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.

2008008, Apr 10, 2008

Oct 10, 2006

11/539893

Gary R. Burhance - Boynton Beach FL, US
John C. Barron - Davie FL, US
Jorge L. Garcia - Plantation FL, US
David J. Meyer - Fort Lauderdale FL, US

MOTOROLA, INC. - Schaumburg IL

H05K 1/18

361761

A printed circuit board and a method for imbedding a battery in the printed circuit board are disclosed. The method includes connecting the battery to a first inner pad and a second inner pad on an inner core layer and forming a first battery contact between a first outer pad and the first inner pad. The method also includes electrically isolating the first battery contact and forming a second battery contact between a second outer pad and the second inner pad.