Inventors:
Frank J. La Bate - Lauderhill FL
John A. De Santis - North Lauderdale FL
Anthony B. Suppelsa - Coral Springs FL
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H06K 102
Abstract:
A multi-layer circuit substrate (500 ) includes at least two substrate layers (130, 150). The first substrate layer (130) has an insulating material (100) with two opposing surfaces (101, 102), and a hole (105) extending between the two surfaces (101, 102). A conductive pattern (110) is formed on a first surface (101) of the insulating material (100) and completely covers the hole (105). The second substrate layer (150) is attached along the second surface (102) of the insulating material (100), and also includes a conductive pattern (155) on insulating material. A conductive material (140) is disposed within the hole (105) that engages the first and second conductive patterns (110, 155).