Inventors:
Jose Omar Rodriguez - Orlando FL, US
Charles A. Storey - Orlando FL, US
John F. Thompson - Orlando FL, US
Assignee:
Agere Systems, Inc. - Allentown PA
International Classification:
B24B001/00
US Classification:
451 56, 451285, 451288, 451527
Abstract:
A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a groove of a second size, wherein the first and second groove sizes are different relative to one another.