Inventors:
John W. Quinn - Crystal Lake IL
Jack A. Fuechsl - Winfield IL
Assignee:
DOT Packaging Group, Inc. - Fort Wayne IN
International Classification:
B29D 2200
US Classification:
428 342, 428 356, 428 76, 4285375, 206531, 206532, 206534
Abstract:
A blister board and a blister package wherein the board and package includes a metallized paper so that the blister material is securely bonded to both the metallized paper and to the underlying paper board material.