Inventors:
Charles Wickersham - Columbus OH, US
Zhiguo Zhang - Columbus OH, US
Larry Ellison - Wellston OH, US
Mikhail Kachalov - Virginia Beach VA, US
John White - Columbus OH, US
International Classification:
G01K001/16
Abstract:
A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.