JOHN C JOHNSON
Engineers in State College, PA
License number
Pennsylvania PE000274K
Category
Engineers
Type
Professional Engineer
Address
Address
State College, PA 16801
Professional information
Advanced Microelectronic Heat Dissipation Package And Method For Its Manufacture
US Patent:
6935022, Aug 30, 2005
Filed:
Aug 28, 2002
Appl. No.:
10/229831
Inventors:
Randall M. German - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US
Assignee:
Advanced Materials Technologies PTE, Ltd. - Singapore
International Classification:
F28F007/00, F28D015/00, B23P006/00
US Classification:
29890032, 16510426, 16510433
Abstract:
Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.
Advanced Microelectronic Heat Dissipation Package And Method For Its Manufacture
US Patent:
2005028, Dec 29, 2005
Filed:
Jun 1, 2005
Appl. No.:
11/141885
Inventors:
Randall German - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US
International Classification:
H05K007/20
US Classification:
165104330, 361700000
Abstract:
Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.
Advanced Microelectronic Heat Dissipation Package And Method For Its Manufacture
US Patent:
2006000, Jan 5, 2006
Filed:
Jun 1, 2005
Appl. No.:
11/141886
Inventors:
Randall German - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US
Lye-King Tan - Singapore, SG
John Johnson - State College PA, US
International Classification:
H05K 7/20
US Classification:
165104330, 361700000
Abstract:
Heat dissipation during the operation of integrated circuit chips is an old problem that continues to get worse. The present invention significantly ameliorates this by placing an embedded heat pipe directly beneath the chip. Using powder injection molding, the lower portion of the package is formed first as an initial green part which includes one or more cavities. The latter are then lined with a feedstock that is designed to produce a porous material after sintering, at which time a working fluid is introduced into the porous cavities and sealed, thereby forming one or more heat pipes located directly below the chip. The latter is then sealed inside an enclosure. During operation, heat generated by the chip is efficiently transferred to points outside the enclosure. A process for manufacturing the structure is also described.