John Brian Sullivan
Engineers at Princeton, Albuquerque, NM
License number
South Dakota 10503
Expiration Date
Mar 31, 2017
Category
Professional Engineer
Type
Mechanical
Address
Address
3737 Princeton Ct NE, Albuquerque, NM 08717
Phone
(505) 344-2366
Professional information
John Sullivan - Rio Rancho, NM
Work:
Integrated Genetics, formerly Genzyme Genetics a LabCorp Company
Associate Director Sprint Nextel Inc
Vendor Call Center Operations Manager Sprint PCS
Call Center Supervisor
Associate Director Sprint Nextel Inc
Vendor Call Center Operations Manager Sprint PCS
Call Center Supervisor
Education:
Project Management Institute PMI - PMI
PMP in Project Management University of Phoenix - Albuquerque, NM
MBA in Business Administration University of Phoenix
Bachelor of Science in Business Management
PMP in Project Management University of Phoenix - Albuquerque, NM
MBA in Business Administration University of Phoenix
Bachelor of Science in Business Management
Skills:
Call Center Management, business strategy, process design, project management, call center project management
John Sullivan - Rio Rancho, NM
Work:
Intel Corp
Equipment Technician Texas Instruments - Dallas, TX
Equipment Technician
Equipment Technician Texas Instruments - Dallas, TX
Equipment Technician
Education:
Arkansas College of Technology
A.S. in Electronic Engineering Technology
A.S. in Electronic Engineering Technology
Method Of Depositing Multi-Layer Carbon-Based Coatings For Field Emission
US Patent:
5935639, Aug 10, 1999
Filed:
Jan 20, 1998
Appl. No.:
9/009140
Inventors:
John P. Sullivan - Albuquerque NM
Thomas A. Friedmann - Albuquerque NM
Thomas A. Friedmann - Albuquerque NM
Assignee:
Sandia Corporation - Livermore CA
International Classification:
B05D 512, B05D 306
US Classification:
427 78
Abstract:
A novel field emitter device for cold cathode field emission applications, comprising a multi-layer resistive carbon film.
The multi-layered film of the present invention is comprised of at least two layers of a resistive carbon material, preferably amorphous-tetrahedrally coordinated carbon, such that the resistivities of adjacent layers differ. For electron emission from the surface, the preferred structure comprises a top layer having a lower resistivity than the bottom layer. For edge emitting structures, the preferred structure of the film comprises a plurality of carbon layers, wherein adjacent layers have different resistivities. Through selection of deposition conditions, including the energy of the depositing carbon species, the presence or absence of certain elements such as H, N, inert gases or boron, carbon layers having desired resistivities can be produced.
Field emitters made according the present invention display improved electron emission characteristics in comparison to conventional field emitter materials.
Multi-Layer Carbon-Based Coatings For Field Emission
US Patent:
5821680, Oct 13, 1998
Filed:
Oct 17, 1996
Appl. No.:
8/731651
Inventors:
John P. Sullivan - Albuquerque NM
Thomas A. Friedmann - Albuquerque NM
Thomas A. Friedmann - Albuquerque NM
Assignee:
Sandia Corporation - Albuquerque NM
International Classification:
H01J 1924
US Classification:
313310
Abstract:
A multi-layer resistive carbon film field emitter device for cold cathode field emission applications. The multi-layered film of the present invention consists of at least two layers of a conductive carbon material, preferably amorphous-tetrahedrally coordinated carbon, where the resistivities of adjacent layers differ. For electron emission from the surface, the preferred structure can be a top layer having a lower resistivity than the bottom layer. For edge emitting structures, the preferred structure of the film can be a plurality of carbon layers, where adjacent layers have different resistivities. Through selection of deposition conditions, including the energy of the depositing carbon species, the presence or absence of certain elements such as H, N, inert gases or boron, carbon layers having desired resistivities can be produced.