John Bailey Jones
Engineering at Chapel Hl Blvd, Plano, TX

License number
Louisiana PE.0020834
Issued Date
Sep 27, 1983
Expiration Date
Sep 30, 2012
Category
Civil Engineer
Type
Civil Engineer
Address
Address
6205 Chapel Hill Blvd SUITE 500, Plano, TX 75093

Professional information

John Jones Photo 1

Mortgage Banking Consultant At Lender Processing Services, Inc. (Lps)

Position:
Mortgage Banking Consultant at Lender Processing Services, Inc. (LPS)
Location:
Jacksonville, Florida
Industry:
Real Estate
Work:
Lender Processing Services, Inc. (LPS) - Jacksonville, Florida Area since Feb 2013 - Mortgage Banking Consultant Arcana Insurance Services, LP - Dallas/Fort Worth Area Jun 2012 - Mar 2013 - Assistant Vice President of Operations Capital One - Plano, TX May 2010 - Jun 2012 - Home Loans Insurance Manager Taylor Bean & Whitaker Mortgage Corp - Ocala, Florida Area Jul 2006 - Aug 2009 - Training Coordinator, Escrow Coordinator First American Real Estate Tax Services - Columbus, Ohio Area Aug 2002 - Jul 2004 - Real Estate Tax Specialist III MILITARY Feb 2002 - Jul 2002 - Air Traffic Controller Elmer's Products Inc - Columbus, Ohio Area Oct 1999 - Feb 2002 - Customer Financial Analyst
Education:
Lakeland High School 1996
Columbus State
Kent State University


John Jones Photo 2

John Jones - Plano, TX

Work:
MARKET INNOVATIONS GROUP, LLC
Principal Consultant - Sales, Marketing & New Business Development
COMPASS GROUP/FOODBUY - Charlotte, NC
Director of New Business Development & Account Management, Dallas, TX
MARKET INNOVATIONS GROUP, LLC - Dallas, TX
Managing Partner - Sales, Marketing & New Business Development
ARAMARK CORPORATION - Philadelphia, PA
Director of Sales & Business Development, Dallas, TX
PEPSICO, INC - Purchase, NY
National Account Sales Director, Plano, TX
HILLSHIRE BRANDS - Chicago, IL
Team Leader/National Sales Manager, Dallas, TX
NESTLE PURINA PETCARE COMPANY - St. Louis, MO
Team Leader, Customer Development, Dallas, TX
Education:
North Carolina Central University - Durham, NC
B.S. in Business Administration
University of Southern California - Los Angeles, CA
Marketing


John Jones Photo 3

John Jones - Plano, TX

Work:
Capital One Home Loans
Insurance Team Supervisor, Insurance Team Lead, Principal Coordinator
Taylor Bean & Whitaker Mortgage Corp
Training Coordinator, Escrow Coordinator
Cingular Wireless - Ocala, FL
Customer Service Representative
First American Real Estate Tax Services
Real Estate Tax Specialist III
Education:
Lakeland High School
College Preparatory
Kent State University
Business Administration
Columbus State Community College
Business Admininistration


John Jones Photo 4

John Jones - Plano, TX

Work:
VCP International
Receiving Manager
Shepherd Controls - Allen, TX
Warehouseman
BulbMan, Inc - Carrollton, TX
Warehouseman
Heat Source, Inc - Dallas, TX
Warehouse Manager
Performance Award Center, Inc - Dallas, TX
Warehouseman
Strategic Telecom - Richardson, TX
Shipping and Receiving Assistant
Steak & Ale - Plano, TX
Daytime Kitchen Coordinator
Interprint Corporation - Plano, TX
Shipping and Receiving Clerk


John Jones Photo 5

Method And Apparatus For Stretching And Processing Saw Film Tape After Breaking A Partially Sawn Wafer

US Patent:
6685073, Feb 3, 2004
Filed:
Nov 20, 1997
Appl. No.:
08/975029
Inventors:
Robert G. McKenna - Houston TX
David Durin - Rowlett TX
Don Brown - Bedford TX
Cecil Davis - Greenville TX
John Jones - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21461
US Classification:
225 2, 225 955, 438464, 83171
Abstract:
A method and apparatus for separating a wafer into wafer portions comprising a larger wafer flex-frame ( ) supported on a support base ( ) and a smaller flex-frame ( ) positioned within the support base ( ). A wafer film transfer cylinder ( ) encompasses a wafer breaking device ( ), such as a convex dome. The transfer cylinder ( ) is slidable downwardly with respect to the dome ( ) to first stretch the wafer tape ( ) and then transfer the wafer ( ) from the larger frame ( ) to the smaller frame ( ) after dome ( ) breaks the wafer ( ) into die. The transfer cylinder ( ) is heated to facilitate removing the saw tape ( ) from the larger frame ( ) after transfer to the smaller frame ( ). The transfer cylinder ( ) is juxtaposed with the smaller frame ( ) residing within a cavity ( ) of the support base ( ). The present invention is suited for automated wafer transfer carriers which advance the broken wafer to pick and place equipment for packaging of the die.


John Jones Photo 6

Isolation Substrate Ring For Plasma Reactor

US Patent:
4891087, Jan 2, 1990
Filed:
Jun 25, 1987
Appl. No.:
7/067055
Inventors:
Cecil J. Davis - Greenville TX
John E. Spencer - Plano TX
Thomas D. Bonifield - Dallas TX
Rhett B. Jucha - Celeste TX
William J. Stiltz - Anna TX
Randall E. Johnson - Carrollton TX
Joseph E. Whetsel - Richardson TX
John I. Jones - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
C23C 1600
US Classification:
156345
Abstract:
A radio frequency (RF) glow discharge plasma etch electrode design is disclosed which is capable of creating high power density plasma with uniform etch rates, while providing access for automatic loading semiconductor wafers from outside of the plasma region. The electrode assembly comprises of an electrode to which RF energy is applied surrounded by an insulator, which in turn surrounded a grounded surface all of which have cylindrical symmetry. When placed a small distance from a flat, grounded substrate, the electrode assembly creates a volume which can effectively combine a high power density plasma, while maintaining a sufficient channel for pumping a gas flow and for observing the plasma optically. The same channel is widened for automatic transport of semiconductor wafers from outside of the plasma reactor chamber. Such confined high power density plasma are important for high rate, uniform, anisotropic etching, especially for silicon dioxide.


John Jones Photo 7

Processing Apparatus And Method

US Patent:
4822450, Apr 18, 1989
Filed:
May 18, 1988
Appl. No.:
7/198632
Inventors:
Cecil J. Davis - Greenville TX
Lee M. Loewenstein - Plano TX
Rhett B. Jucha - Celeste TX
Robert T. Matthews - Plano TX
Randall C. Hildenbrand - Richardson TX
Dean W. Freeman - Garland TX
John I. Jones - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
B44C 122, H01L 21306, C03C 1500, C03C 2506
US Classification:
156643
Abstract:
A processing apparatus and method compatible with a vacuum process system for wafers, wherein an in situ source of ultraviolet light is provided to enhance chemical activity at the wafer surface, and a remote plasma source is provided in the process gas flow upstream of the wafer, to provide activated species to the wafer face, and a radiatively coupled heat source is also provided so that the wafer can be rapidly thermally cycled.


John Jones Photo 8

Powered Load Lock Electrode/Substrate Assembly Including Robot Arm, Optimized For Plasma Process Uniformity And Rate

US Patent:
4657618, Apr 14, 1987
Filed:
Oct 22, 1984
Appl. No.:
6/663804
Inventors:
John E. Spencer - Plano TX
Randall E. Johnson - Carrollton TX
Dan T. Hockersmith - Garland TX
Randall C. Hildenbrand - Richardson TX
John I. Jones - Plano TX
William S. Jaspersen - Dallas TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21306, B44C 122, C03C 1500, C23F 102
US Classification:
156345
Abstract:
An electrode and substrate assembly for a plasma reactor allows high power plasma processing with low frequency excitation. The electrode sub-assembly is contained in a chamber which is used for pre-treatment such as de-scumming photoresist or for post-etch resist stripping and passivation. A post-etch treatment is essential in plasma aluminum etching.


John Jones Photo 9

Processing Apparatus

US Patent:
4836905, Jun 6, 1989
Filed:
Jul 16, 1987
Appl. No.:
7/075018
Inventors:
Cecil J. Davis - Greenville TX
Joseph V. Abernathy - Wylie TX
Robert T. Matthews - Plano TX
Randall C. Hildenbrand - Richardson TX
Bruce Simpson - Dallas TX
James G. Bohlman - Forney TX
Lee M. Loewenstein - Plano TX
John I. Jones - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
C23C 1334
US Classification:
204298
Abstract:
A processing apparatus and method which permits sputter deposition and which is compatible with a vacuum processing system wherein the wafers are largely transferred and processed in the face down position. This includes an additional wafer movement, wherein, after a wafer has been emplaced face down, in a position where it can be clamped against the susceptor, the susceptor is rotated from its approximately horizontal position up to a more nearly vertical position. While the wafer is in the more nearly vertical position, sputter deposition may be performed. In situ or remote plasma capability is usefully provided in the bottom part of the chamber, so that a dry deglaze or cleanup step can be performed while the wafer is in its substantially horizontal position, followed by a sputter deposition after the wafer has been moved to its more nearly vertical position.


John Jones Photo 10

Processing Apparatus And Method

US Patent:
4886570, Dec 12, 1989
Filed:
Dec 2, 1988
Appl. No.:
7/282993
Inventors:
Cecil J. Davis - Greenville TX
Robert T. Matthews - Plano TX
Lee M. Loewenstein - Plano TX
Rhett B. Jucha - Celeste TX
Randall C. Hildenbrand - Richardson TX
John I. Jones - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
B44C 122, C03C 1500, B05D 306, C23C 1400
US Classification:
156643
Abstract:
A process module having remote plasma and in situ plasma generators, a source of ultraviolet, and a radiant heater, which represent four separate energy sources. The four sources can be used singly or in any combination and can be separately controllable.